H01L2224/7965 - CPC Classification Index

ClassID:

210711 ⎘

H01L2224/7965 - CPC Classification

Classification description:

Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto; Apparatus for Tape Automated Bonding [TAB] Means for transporting the components to be connected

Sub-classes:

H01L2224/79651 » Belt conveyor 0
H01L2224/79652 » Chain conveyor 1
H01L2224/79653 » Vibrating conveyor 0
H01L2224/79654 » Pneumatic conveyor 0
H01L2224/79655 » in a fluid 0

Recent Application in this class:

20120117797

Packaging or mounting a component

20080210368

Method and device for transferring a chip to a contact substrate

20080042168

Laminating system, IC sheet, scroll of IC sheet, and method for manufacturing IC chip

20080006922

Thermal release adhesive-backed carrier tapes

20070102486

WIRE EMBEDDED BRIDGE

20070098942

Device for making an in-mold circuit

20070053310

Manufacturing method of electronic device

20060194371

Method of manufacturing semiconductor device

20060177968

Method for fabricating semiconductor packages with semiconductor chips

20060057293

Thermally controlled fluidic self-assembly

20060026819

Manufacture of RFID tags and intermediate products therefor

18597172

Chip bonding apparatus and securing assembly therefor