ClassID:

210739

H01L2224/79803 - CPC Classification

Classification description:

Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto; Apparatus for Tape Automated Bonding [TAB]; Means for moving parts; Lower part of the bonding apparatus, e.g. XY table; Rotational mechanism Pivoting mechanism