H01L2224/799 - CPC Classification

Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto; Apparatus for Tape Automated Bonding [TAB] Means for monitoring the connection process

• H01L2224/79901 » using a computer, e.g. fully- or semi-automatic bonding 0
• H01L2224/7992 » Load or pressure adjusting means, e.g. sensors 0
• H01L2224/79925 » Vibration adjusting means, e.g. sensors 0