210782 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected by connecting a bonding area directly to another bonding area, i.e. connectorless bonding, e.g. bumpless bonding; Pre-treatment of the bonding area; Reshaping the bonding area in the bonding apparatus, e.g. flattening the bonding area by heating means using a laser
SYSTEMS AND METHODS FOR BONDING SEMICONDUCTOR DEVICES
#2MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
#3Manufacturing method of semiconductor device
#4Manufacturing method of semiconductor device
#5Packages with solder ball revealed through layer