H01L2224/8012 - CPC Classification Index

ClassID:

210804 ⎘

H01L2224/8012 - CPC Classification

Classification description:

Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected by connecting a bonding area directly to another bonding area, i.e. connectorless bonding, e.g. bumpless bonding Aligning

Sub-classes:

H01L2224/80121 » Active alignment, i.e. by apparatus steering, e.g. optical alignment using marks or sensors 43
H01L2224/80136 » involving guiding structures, e.g. spacers or supporting members 12
H01L2224/80143 » Passive alignment, i.e. self alignment, e.g. using surface energy, chemical reactions, thermal equilibrium 30
H01L2224/80148 » involving movement of a part of the bonding apparatus 0

Recent Application in this class:

20260018515

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

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METHOD AND APPARATUS FOR DETECTING DEFECTS IN A PACKAGE

20240313026

METHOD FOR FABRICATING HYBRID BONDED STRUCTURE

20240266317

Substrate bonding apparatus and method of manufacturing semiconductor device by using the same

20240063172

Systems and methods for direct bonding in semiconductor die manufacturing

20230378126

Reworkable inter-substrate bond structure

20230352437

HYBRID INTERCONNECT FOR LASER BONDING USING NANOPOROUS METAL TIPS

20230307361

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

20230145031

Semiconductor structure and method for forming semiconductor structure, stacked structure, and wafer stacking method

20230020037

Systems and methods for direct bonding in semiconductor die manufacturing

20230005866

Semiconductor structure and manufacturing method thereof

20220359601

Method for fabricating hybrid bonded structure

20210057373

Substrate bonding apparatus and method of manufacturing semiconductor device by using the same

20210013172

Method of transferring micro device

20200295070

Hybrid bonded structure

20200235063

Three-dimensional integrated circuit and method of manufacturing the same

20200035641

POST CMP PROCESSING FOR HYBRID BONDING

20190252353

Face-to-face three-dimensional integrated circuit of simplified structure

20190157333

Hybrid bonded structure

20180247913

Semiconductor device and method for manufacturing the same

20180226390

Method of manufacturing substrate structure

20170358553

Wafer-to-wafer bonding structure

20170062273

High quality electrical contacts between integrated circuit chips

20150270304

Semiconductor device, imaging device and semiconductor device manufacturing method

20150212340

Assembly bonding

20100270674

High quality electrical contacts between integrated circuit chips

17648313

Semiconductor structure and manufacturing method thereof

16540037

Semiconductor structure and method of manufacturing thereof

16283081

Semiconductor device and manufacturing method thereof