210805 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected by connecting a bonding area directly to another bonding area, i.e. connectorless bonding, e.g. bumpless bonding; Aligning Active alignment, i.e. by apparatus steering, e.g. optical alignment using marks or sensors
Sub-classes:METHOD AND APPARATUS FOR BONDING SUBSTRATES
#2METHOD OF BONDING CHIPS AND A SYSTEM FOR PERFORMING THE METHOD
#3METHOD AND DEVICE FOR MANUFACTURING STACKED SUBSTRATE
#4Bonding apparatus and bonding method
#5Methods and devices for fabricating and assembling printable semiconductor elements
#6Semiconductor storage device including first pads on a first chip that are bonded to second pads on a second chip
#7Connectivity detection for wafer-to-wafer alignment and bonding
#8Semiconductor device and imaging device
#9Process for manufacturing an LED-based emissive display device
#10Method and device for manufacturing stacked substrate
#11Hybrid bonding with through substrate via (TSV)
#12Methods and devices for fabricating and assembling printable semiconductor elements
#13Method for arranging two substrates
#14Semiconductor device and imaging device
#15Location displacement detection method, location displacement detection device, and display device
#16Clip for semiconductor package
#17Hybrid bonding systems and methods for semiconductor wafers
#18Method of manufacturing a semiconductor device
#19Semiconductor device and imaging device
#20Conductive pad structure for hybrid bonding and methods of forming same
#21Hybrid bonding systems and methods for semiconductor wafers
#22Methods and devices for fabricating and assembling printable semiconductor elements
#23Apparatus and method for verification of bonding alignment
#24Conductive pad structure for hybrid bonding and methods of forming same
#25Methods and devices for fabricating and assembling printable semiconductor elements
#26Methods and devices for fabricating and assembling printable semiconductor elements
#27Hybrid bonding mechanisms for semiconductor wafers
#28Hybrid bonding systems and methods for semiconductor wafers
#29Semiconductor device, method of manufacturing a semiconductor device, and positioning jig
#30Bonded processed semiconductor structures and carriers
#31Method for aligning micro-electronic components
#32Conductive pad structure for hybrid bonding and methods of forming same
#33Hybrid bonding and apparatus for performing the same
#34Methods and devices for fabricating and assembling printable semiconductor elements
#35Hybrid bonding mechanisms for semiconductor wafers
#36Hybrid bonding systems and methods for semiconductor wafers
#37Bonded processed semiconductor structures and carriers
#38Magnet assisted alignment method for wafer bonding and wafer level chip scale packaging
#39Using backside passive elements for multilevel 3D wafers alignment applications
#40Methods for directly bonding together semiconductor structures, and bonded semiconductor structures formed using such methods
#41Methods of forming bonded semiconductor structures using a temporary carrier having a weakened ion implant region for subsequent separation along the weakened region
#42Methods and devices for fabricating and assembling printable semiconductor elements
#43Methods and devices for fabricating and assembling printable semiconductor elements
#44Methods and devices for fabricating and assembling printable semiconductor elements
#45Stretchable semiconductor elements and stretchable electrical circuits
#46Clip for semiconductor package