210815 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected by connecting a bonding area directly to another bonding area, i.e. connectorless bonding, e.g. bumpless bonding; Aligning involving guiding structures, e.g. spacers or supporting members the guiding structures being at least partially left in the finished device Guiding structures on the body
STRUCTURES AND METHODS FOR BONDING DIES
#2BONDING TO ALIGNMENT MARKS WITH DUMMY ALIGNMENT MARKS
#3MULTI-DIE-TO-WAFER HYBRID BONDING
#4Bonding to alignment marks with dummy alignment marks
#5Bonding to alignment marks with dummy alignment marks
#6Micro-pillar assisted semiconductor bonding