210822 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected by connecting a bonding area directly to another bonding area, i.e. connectorless bonding, e.g. bumpless bonding; Aligning involving movement of a part of the bonding apparatus being the lower part of the bonding apparatus, i.e. holding means for the bodies to be connected, e.g. XY table Translational movements
METHOD AND APPARATUS FOR BONDING SUBSTRATES
#2METHOD OF BONDING CHIPS AND A SYSTEM FOR PERFORMING THE METHOD
#3FLIP-CHIP BONDING APPARATUS AND METHOD OF USING THE SAME
#4BONDING APPARATUS, BONDING SYSTEM, AND BONDING METHOD
#5Device and method for the alignment of substrates