H01L2224/804 - CPC Classification

Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected by connecting a bonding area directly to another bonding area, i.e. connectorless bonding, e.g. bumpless bonding; Bonding interfaces outside the semiconductor or solid-state body; Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof

• H01L2224/80401 » the principal constituent melting at a temperature of less than 400°C 0
• H01L2224/80417 » the principal constituent melting at a temperature of greater than or equal to 400°C and less than 950°C 0
• H01L2224/80438 » the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C 1
• H01L2224/80463 » the principal constituent melting at a temperature of greater than 1550°C 0

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