210867 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected by connecting a bonding area directly to another bonding area, i.e. connectorless bonding, e.g. bumpless bonding; Bonding interfaces outside the semiconductor or solid-state body; Material with a principal constituent of the material being a non metallic, non metalloid inorganic material Ceramics, e.g. crystalline carbides, nitrides or oxides
Silicon carbide composite wafer and manufacturing method thereof
#2Die encapsulation in oxide bonded wafer stack
#3Die encapsulation in oxide bonded wafer stack
#4Microelectronic assemblies formed using metal silicide, and methods of fabrication
#5Multi-wafer pair anodic bonding apparatus and method
#6Flattened substrate surface for substrate bonding
#7Flattened substrate surface for substrate bonding