210868 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected by connecting a bonding area directly to another bonding area, i.e. connectorless bonding, e.g. bumpless bonding; Bonding interfaces outside the semiconductor or solid-state body; Material with a principal constituent of the material being a non metallic, non metalloid inorganic material Glasses, e.g. amorphous oxides, nitrides or fluorides
Silicon carbide composite wafer and manufacturing method thereof
#2Semiconductor device and method for manufacturing a semiconductor device
#3Multi-wafer pair anodic bonding apparatus and method
#4Method of sealing and contacting substrates using laser light and electronics module
#5Electronic component mounting structure