210869 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected by connecting a bonding area directly to another bonding area, i.e. connectorless bonding, e.g. bumpless bonding; Bonding interfaces outside the semiconductor or solid-state body; Material with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
Sub-classes:OPTICAL AND ELECTRICAL GLASS INTERPOSER WITH EMBEDDED BRIDGE
#2TECHNOLOGIES FOR DIE RECYCLING FOR HIGH YIELD PACKAGING
#3HYBRID BONDING A DIE TO A SUBSTRATE WITH VIAS CONNECTING METAL PADS ON BOTH SIDES OF THE DIE
#4Electronic device and method of manufacturing electronic device