210899 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected by connecting a bonding area directly to another bonding area, i.e. connectorless bonding, e.g. bumpless bonding; Bonding techniques Anodic bonding, i.e. bonding by applying a voltage across the interface in order to induce ions migration leading to an irreversible chemical bond
BONDING METHOD, BONDED ARTICLE, AND BONDING DEVICE
#2Method for bonding substrates together, and substrate bonding device
#3Wafer to wafer bonding process and structures
#4Multi-wafer pair anodic bonding apparatus and method
#5Integrated circuit, a chip package and a method for manufacturing an integrated circuit
#6MEMS pressure sensor device and manufacturing method thereof