H01L2224/808 - CPC Classification

Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected by connecting a bonding area directly to another bonding area, i.e. connectorless bonding, e.g. bumpless bonding Bonding techniques

• H01L2224/80801 » Soldering or alloying 62
• H01L2224/8084 » Sintering 15
• H01L2224/8085 » using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester 17
• H01L2224/8089 » using an inorganic non metallic glass type adhesive, e.g. solder glass 7
• H01L2224/80893 » Anodic bonding, i.e. bonding by applying a voltage across the interface in order to induce ions migration leading to an irreversible chemical bond 6
• H01L2224/80894 » Direct bonding, i.e. joining surfaces by means of intermolecular attracting interactions at their interfaces, e.g. covalent bonds, van der Waals forces 153
• H01L2224/80897 » Mechanical interlocking, e.g. anchoring, hook and loop-type fastening or the like 13

Recent Application in this class: