Patents-Review.com
ClassID:

210900 ⎘

H01L2224/80894 - CPC Classification

Classification description:

Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected by connecting a bonding area directly to another bonding area, i.e. connectorless bonding, e.g. bumpless bonding; Bonding techniques Direct bonding, i.e. joining surfaces by means of intermolecular attracting interactions at their interfaces, e.g. covalent bonds, van der Waals forces

Sub-classes:
Recent Application in this class:
#1
20260047466
2026-02-12

BONDING APPARATUS AND METHOD OF BONDING SEMIOCONDUCTOR CHIPS

 #2
20260026410
2026-01-22

METHOD AND DEVICE FOR BONDING OF CHIPS

 #3
20260018556
2026-01-15

SUBSTRATE BONDING DEVICE, SUBSTRATE BONDING SYSTEM INCLUDING THE SAME, AND SUBSTRATE BONDING METHOD USING THE SAME

 #4
20250391664
2025-12-25

Plasma Dicing for Multi-Tier Die for Die Strength Enhancement and Irregular Shaped Dicing

 #5
20250385216
2025-12-18

DIE BONDING SYSTEMS, AND METHODS OF USING THE SAME

 #6
20250357418
2025-11-20

BONDING TOOL AND BONDING METHOD THEREOF

 #7
20250336882
2025-10-30

SUBSTRATE ALIGNMENT METHOD

 #8
20250233105
2025-07-17

SYSTEM AND METHOD FOR CLEANING SILICON AND HYDROCARBON CONTACT RESIDUE FROM CHIP SURFACES USING ATMOSPHERIC PLASMA

 #9
20250219016
2025-07-03

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

 #10
20250118688
2025-04-10

CHIP PACKAGING STRUCTURE

 #11
20250112119
2025-04-03

DISTRIBUTION OF COOLING ACROSS MULTIPLE SUBSTRATES OR DIE

 #12
20250087608
2025-03-13

INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING SAME

 #13
20250006669
2025-01-02

PACKAGE STRUCTURE WITH TRANSMISSION LINE AND METHOD FOR MANUFACTURING THE SAME

 #14
20240397722
2024-11-28

SEMICONDUCTOR MEMORY

 #15
20240371828
2024-11-07

SEMICONDUCTOR STACK STRUCTURE AND MANUFACTURING METHOD THEREOF

 #16
20240321829
2024-09-26

SEMICONDUCTOR STORAGE DEVICE AND SEMICONDUCTOR DEVICE

 #17
20240297143
2024-09-05

BONDING TOOL AND BONDING METHOD THEREOF

 #18
20240250059
2024-07-25

COMPLIANT CHUCK EDGE RING

 #19
20240242981
2024-07-18

SUBSTRATE BONDING APPARATUS AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE USING THE SAME

 #20
20240234215
2024-07-11

APPARATUS FOR MEASURING AN ADHESION FORCE

 #21
20240234154
2024-07-11

METHOD OF PROCESSING WAFER

 #22
20240203970
2024-06-20

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

 #23
20240170474
2024-05-23

METHOD AND DEVICE FOR BONDING OF CHIPS

 #24
20240136231
2024-04-25

APPARATUS FOR MEASURING AN ADHESION FORCE

 #25
20240136193
2024-04-25

METHOD OF PROCESSING WAFER

 #26
20240087879
2024-03-14

Integrate rinse module in hybrid bonding platform

 #27
20240079373
2024-03-07

BONDING SYSTEM AND BONDING METHOD

 #28
20240071935
2024-02-29

GLASS DIE-TO-DIE BRIDGE AND INTERPOSER FOR DIE FIRST ARCHITECTURE

 #29
20240055390
2024-02-15

Manufacturing method of semiconductor device

 #30
20240038693
2024-02-01

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

 #31
20240006379
2024-01-04

Semiconductor stack structure and manufacturing method thereof

 #32
20230411344
2023-12-21

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

 #33
20230361075
2023-11-09

Semiconductor structure and manufacturing method thereof

 #34
20230345726
2023-10-26

Semiconductor memory

 #35
20230317656
2023-10-05

SEMICONDUCTOR DEVICE

 #36
20230307423
2023-09-28

Semiconductor device and method of fabricating the same

 #37
20230253351
2023-08-10

Integrated circuit package and method of forming same

 #38
20230246015
2023-08-03

Semiconductor device and method of manufacturing the same

 #39
20230230995
2023-07-20

Semiconductor device including through via, semiconductor package, and method of fabricating the same

 #40
20230223377
2023-07-13

Wafer bonding device and wafer bonding method

 #41
20230207513
2023-06-29

Device and method for the alignment of substrates

 #42
20230201613
2023-06-29

Interconnect Structure and Method of Forming Same

 #43
20230163095
2023-05-25

DIE BONDING SYSTEMS, AND METHODS OF USING THE SAME

 #44
20230163094
2023-05-25

APPARATUS FOR BONDING CHIP BAND AND METHOD FOR BONDING CHIP USING THE SAME

 #45
20230116320
2023-04-13

Stacked Integrated Circuit Device

 #46
20230050150
2023-02-16

STACKED ARCHITECTURE FOR THREE-DIMENSIONAL NAND

 #47
20230032570
2023-02-02

Bonding tool and bonding method thereof

 #48
20230028219
2023-01-26

DIE BONDING METHOD AND DIE BONDING APPARATUS

 #49
20230005876
2023-01-05

Metal-dielectric bonding method and structure

 #50
20220415831
2022-12-29

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

 #51
20220384385
2022-12-01

Silicon carbide composite wafer and manufacturing method thereof

 #52
20220328447
2022-10-13

Semiconductor structure and manufacturing method thereof

 #53
20220319835
2022-10-06

LAMINATION WAFERS AND METHOD OF PRODUCING BONDED WAFERS USING THE SAME

 #54
20220293552
2022-09-15

Semiconductor device and method of manufacturing the same

 #55
20220238479
2022-07-28

Metal-dielectric bonding method and structure

 #56
20220216169
2022-07-07

Semiconductor device and manufacturing method of the same

 #57
20220216052
2022-07-07

Integrate rinse module in hybrid bonding platform

 #58
20220208749
2022-06-30

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURE THEREOF

 #59
20220199603
2022-06-23

Semiconductor device and method of manufacturing the same

 #60
20220045030
2022-02-10

Bonding apparatus and bonding method

 #61
20210398948
2021-12-23

Semiconductor device and method of fabricating the same

 #62
20210358900
2021-11-18

Semiconductor device and method of manufacturing the same

 #63
20210217790
2021-07-15

Infrared detector having a directly bonded silicon substrate present on top thereof

 #64
20210210459
2021-07-08

Metal-dielectric bonding method and structure

 #65
20210151465
2021-05-20

Semiconductor memory

 #66
20210134782
2021-05-06

Device for bonding chips

 #67
20210082869
2021-03-18

Wafer-level package structure

 #68
20210043570
2021-02-11

Ultrathin bridge and multi-die ultrafine pitch patch architecture and method of making

 #69
20200343293
2020-10-29

Semiconductor apparatus and equipment

 #70
20200343291
2020-10-29

Semiconductor device including through via, semiconductor package, and method of fabricating the same

 #71
20200343263
2020-10-29

Semiconductor memory

 #72
20200343235
2020-10-29

Three-dimensional memory device with logic signal routing through a memory die and methods of making the same

 #73
20200343223
2020-10-29

Package structure, package-on-package structure and method of fabricating the same

 #74
20200343216
2020-10-29

Bonding apparatus, bonding system, bonding method and storage medium

 #75
20200306552
2020-10-01

Interconnect structure and method of forming same

 #76
20200286876
2020-09-10

Semiconductor device and method of manufacturing the same

 #77
20200243498
2020-07-30

Three-dimensional memory device with logic signal routing through a memory die and methods of making the same

 #78
20200235012
2020-07-23

Method for producing a plurality of components

 #79
20200212004
2020-07-02

Plasma activation treatment for wafer bonding

 #80
20200203316
2020-06-25

Stacked architecture for three-dimensional NAND

 #81
20200194403
2020-06-18

Multi-deck three-dimensional memory devices and methods for forming the same

 #82
20200176437
2020-06-04

Method and device for bonding of chips

 #83
20200176434
2020-06-04

Semiconductor device and method of manufacturing the same

 #84
20200152597
2020-05-14

Bonding method with electron-stimulated desorption

 #85
20200119063
2020-04-16

Infrared detector having a directly bonded silicon substrate present on top thereof

 #86
20200111810
2020-04-09

Semiconductor memory

 #87
20200111667
2020-04-09

Preparation of compound semiconductor substrate for epitaxial growth via non-destructive epitaxial lift-off

 #88
20200105630
2020-04-02

Probe methodology for ultrafine pitch interconnects

 #89
20200075550
2020-03-05

Multi-wafer bonding structure and bonding method

 #90
20200075538
2020-03-05

Wafer-level system packaging method and package structure

 #91
20200075537
2020-03-05

Wafer-level packaging method and package structure

 #92
20200075536
2020-03-05

Wafer-level packaging method and package structure thereof

 #93
20200066683
2020-02-27

Semiconductor device and method of fabricating the same

 #94
20200035641
2020-01-30

POST CMP PROCESSING FOR HYBRID BONDING

 #95
20200013720
2020-01-09

Stretchable form of single crystal silicon for high performance electronics on rubber substrates

 #96
20200006052
2020-01-02

Integrate rinse module in hybrid bonding platform

 #97
20190386051
2019-12-19

Semiconductor device including through via, semiconductor package, and method of fabricating the same

 #98
20190385973
2019-12-19

Bonding apparatus, bonding system, bonding method and storage medium

 #99
20190319006
2019-10-17

Nanowire enabled substrate bonding and electrical contact formation

 #100
20190287955
2019-09-19

Semiconductor device and method of manufacturing the same

 #101
20190279974
2019-09-12

Semiconductor Devices and Methods of Manufacture Thereof

 #102
20190279965
2019-09-12

3D stack of electronic chips

 #103
20190252353
2019-08-15

Face-to-face three-dimensional integrated circuit of simplified structure

 #104
20190252222
2019-08-15

Method for transferring micro device

 #105
20190252221
2019-08-15

Method for transferring micro device

 #106
20190148435
2019-05-16

Interconnect apparatus and method for a stacked semiconductor device

 #107
20190115316
2019-04-18

Packaging method and package structure of wafer-level system-in-package

 #108
20190115314
2019-04-18

Methods and structures for wafer-level system in package

 #109
20190103332
2019-04-04

Wafer-level system-in-package structure and electronic apparatus thereof

 #110
20190046806
2019-02-14

Interconnect structure and method of forming same

 #111
20180331000
2018-11-15

Probe methodology for ultrafine pitch interconnects

 #112
20180240709
2018-08-23

Method for transferring at least one thin film

 #113
20180226390
2018-08-09

Method of manufacturing substrate structure

 #114
20180218999
2018-08-02

Direct bonding method

 #115
20180218997
2018-08-02

Method for direct bonding with self-alignment using ultrasound

 #116
20180158796
2018-06-07

Bonding apparatus, bonding system, bonding method and storage medium

 #117
20180158719
2018-06-07

Method for direct bonding of substrates including thinning of the edges of at least one of the two substrates

 #118
20180151436
2018-05-31

Direct bonding method

 #119
20180144999
2018-05-24

Method of semiconductor wafer bonding and system thereof

 #120
20180122785
2018-05-03

Direct bandgap semiconductor bonded to silicon photonics

 #121
20180102351
2018-04-12

Method of manufacturing semiconductor devices having conductive plugs with varying widths

 #122
20180096962
2018-04-05

SUBSTRATE ATTACHMENT FOR ATTACHING A SUBSTRATE THERETO

 #123
20180019226
2018-01-18

Bonding system

 #124
20180001099
2018-01-04

Interconnect structure and method of forming same

 #125
20170170155
2017-06-15

Semiconductor device and method

 #126
20170110496
2017-04-20

Interconnect apparatus and method

 #127
20170047260
2017-02-16

Apparatus and method for verification of bonding alignment

 #128
20170018530
2017-01-19

Multi-die semiconductor structure with intermediate vertical side chip and semiconductor package for same

 #129
20170004964
2017-01-05

Integrate rinse module in hybrid bonding platform

 #130
20160359002
2016-12-08

Semiconductor-on-insulator with back side heat dissipation

 #131
20160358881
2016-12-08

Method for bonding substrates

 #132
20160190089
2016-06-30

Wafer to wafer bonding process and structures

 #133
20160155721
2016-06-02

Bonding method, storage medium, bonding apparatus and bonding system

 #134
20160005718
2016-01-07

Multi-die semiconductor structure with intermediate vertical side chip and semiconductor package for same

 #135
20150311179
2015-10-29

TRANSISTOR FORMATION USING COLD WELDING

 #136
20150279816
2015-10-01

Bonding structure for stacked semiconductor devices

 #137
20150233698
2015-08-20

Apparatus and method for verification of bonding alignment

 #138
20150179605
2015-06-25

Method for aligning micro-electronic components

 #139
20150171132
2015-06-18

Image sensor devices, methods of manufacture thereof, and semiconductor device manufacturing methods

 #140
20150137325
2015-05-21

Semiconductor device having metal patterns and piezoelectric patterns

 #141
20150069511
2015-03-12

Semiconductor-on-insulator with back side strain topology

 #142
20150001462
2015-01-01

Stretchable form of single crystal silicon for high performance electronics on rubber substrates

 #143
20140332951
2014-11-13

Semiconductor device

 #144
20140264947
2014-09-18

Interconnect apparatus and method

 #145
20140264883
2014-09-18

Interconnect structure and method of forming same

 #146
20140094006
2014-04-03

Transistor formation using cold welding

 #147
20140091370
2014-04-03

Transistor formation using cold welding

 #148
20140084302
2014-03-27

Integrated circuit, a chip package and a method for manufacturing an integrated circuit

 #149
20130341803
2013-12-26

Method to enable controlled side chip interconnection for 3D integrated packaging system

 #150
20130284885
2013-10-31

Method and apparatus for image sensor packaging

 #151
20130205908
2013-08-15

MEMS pressure sensor device and manufacturing method thereof

 #152
20130113106
2013-05-09

Three-dimensional (3D) integrated circuit with enhanced copper-to-copper bonding

 #153
20120292748
2012-11-22

Methods and structures for forming integrated semiconductor structures

 #154
20120205725
2012-08-16

Semiconductor-on-insulator with back side strain inducing material

 #155
20120168962
2012-07-05

Thin wafer protection device

 #156
20120153492
2012-06-21

Method of fabrication of through-substrate vias

 #157
20120153484
2012-06-21

Methods for directly bonding together semiconductor structures, and bonded semiconductor structures formed using such methods

 #158
20120068355
2012-03-22

Semiconductor device and method for manufacturing the same

 #159
20120013013
2012-01-19

Methods of forming bonded semiconductor structures using a temporary carrier having a weakened ion implant region for subsequent separation along the weakened region

 #160
20110012199
2011-01-20

Semiconductor-on-insulator with back side heat dissipation

 #161
20100244284
2010-09-30

Method for ultra thin wafer handling and processing

 #162
20100059863
2010-03-11

Stretchable form of single crystal silicon for high performance electronics on rubber substrates

 #163
20060286785
2006-12-21

Stretchable form of single crystal silicon for high performance electronics on rubber substrates

 #164
20050170626
2005-08-04

Semiconductor device and method for fabricating the device

 #165
16453927
2020-03-24

Multi-deck three-dimensional memory devices and methods for forming the same

 #166
16283081
2020-05-12

Semiconductor device and manufacturing method thereof