210912 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected by connecting a bonding area directly to another bonding area, i.e. connectorless bonding, e.g. bumpless bonding; Combinations of bonding methods provided for in at least two different groups from - Specific sequence of method steps
DIRECT BONDING METHODS AND STRUCTURES
#2DIRECTLY BONDED METAL STRUCTURES HAVING ALUMINUM FEATURES AND METHODS OF PREPARING SAME
#3Bond pads for low temperature hybrid bonding
#4Bond pads for low temperature hybrid bonding
#5Conductive pad structure for hybrid bonding and methods of forming same
#6Conductive pad structure for hybrid bonding and methods of forming same
#7Conductive pad structure for hybrid bonding and methods of forming same
#8Method of assembly by direct bonding between two elements, each element comprising portions of metal and dielectric materials
#9Hermetic wafer-to-wafer bonding with electrical interconnection
#10HERMETIC WAFER-TO-WAFER BONDING WITH ELECTRICAL INTERCONNECTION
#11Room temperature metal direct bonding
#12Room temperature metal direct bonding
#13Room temperature metal direct bonding