210959 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector; Pre-treatment of the bump connector or the bonding area Forming additional members
A SEMICONDUCTOR STRUCTURE AND METHOD MAKING THE SAME
#2Injection molded solder bumping
#3Bump electrode, board which has bump electrodes, and method for manufacturing the board
#4Injection molded solder bumping