H01L2224/81009 - CPC Classification Index

ClassID:

210940 ⎘

H01L2224/81009 - CPC Classification

Classification description:

Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector Pre-treatment of the bump connector or the bonding area

Sub-classes:

H01L2224/8101 » Cleaning the bump connector, e.g. oxide removal step, desmearing 34
H01L2224/8102 » Applying permanent coating to the bump connector in the bonding apparatus, e.g. in-situ coating 23
H01L2224/81022 » Cleaning the bonding area, e.g. oxide removal step, desmearing 41
H01L2224/81024 » Applying flux to the bonding area 210
H01L2224/81026 » Applying a precursor material to the bonding area 34
H01L2224/8103 » Reshaping the bump connector in the bonding apparatus, e.g. flattening the bump connector 0
H01L2224/81048 » Thermal treatments, e.g. annealing, controlled pre-heating or pre-cooling 50
H01L2224/81051 » Forming additional members 3

Recent Application in this class:

20250391811

2025-12-25

UTILIZING FORMATE SHELLS FOR METAL STRUCTURES ON INTEGRATED CIRCUIT COMPONENTS

20240395768

2024-11-28

MULTI-VIEW DEPTH ESTIMATION LEVERAGING OFFLINE STRUCTURE-FROM-MOTION

20230352437

2023-11-02

HYBRID INTERCONNECT FOR LASER BONDING USING NANOPOROUS METAL TIPS

20220406749

2022-12-22

ELECTRICAL CONNECTION METHOD FOR ELECTRONIC ELEMENT, AND RELATED APPARATUS THEREOF

20200357774

2020-11-12

Manufacturing of flip-chip electronic device with carrier having heat dissipation elements free of solder mask

20200303365

2020-09-24

Contoured package-on-package joint

20190123027

2019-04-25

Package-on-package (PoP) structure including stud bulbs

20190043838

2019-02-07

Flip-chip electronic device with carrier having heat dissipation elements free of solder mask

20180261587

2018-09-13

Contoured package-on-package joint

#10

20180047709

2018-02-15

Package-on-package (PoP) structure including stud bulbs

#11

20180043478

2018-02-15

No clean flux composition and methods for use thereof

#12

20170173745

2017-06-22

NO CLEAN FLUX COMPOSITION AND METHODS FOR USE THEREOF

#13

20170053890

2017-02-23

Electrostatic discharge protection apparatus and process

#14

20170025391

2017-01-26

Package on-package (PoP) structure including stud bulbs

#15

20160307874

2016-10-20

Flip-chip electronic device with carrier having heat dissipation elements free of solder mask

#16

20160197067

2016-07-07

Contoured package-on-package joint

#17

20160084638

2016-03-24

Pressure application apparatus and pressure application method

#18

20150311177

2015-10-29

Chip packaging method and chip package using hydrophobic surface

#19

20150287640

2015-10-08

Protecting flip-chip package using pre-applied fillet

#20

20150132889

2015-05-14

Package on-Package (PoP) structure including stud bulbs and method

#21

20140124937

2014-05-08

Contoured package-on-package joint

#22

20130134588

2013-05-30

Package-on-package (PoP) structure including stud bulbs and method

#23

20120127485

2012-05-24

Pressure application apparatus and pressure application method

#24

20120119354

2012-05-17

Protecting flip-chip package using pre-applied fillet

#25

20120104076

2012-05-03

Joining method and device produced by this method and joining unit

#26

20110039375

2011-02-17

Method of manufacturing semiconductor device

#27

20100252615

2010-10-07

Joining method and device produced by this method and joining unit

#28

20100195292

2010-08-05

Electronic member, electronic part and manufacturing method therefor

#29

20090145546

2009-06-11

Electrode bonding method and part mounting apparatus

#30

20080245843

2008-10-09

Joining method and device produced by this method and joining unit

#31

20070193682

2007-08-23

Bonding method and apparatus

#32

20070111527

2007-05-17

Method for producing and cleaning surface-mountable bases with external contacts

#33

20070001320

2007-01-04

Bonding apparatus and method

#34

20060054283

2006-03-16

Joining apparatus