Semiconductor chip, method of manufacturing semiconductor chip, and semiconductor device

Low profile stacking system and method

Chip structure and stacked structure of chips

Carbon nanotube structures for enhancement of thermal dissipation from semiconductor modules

SEMICONDUCTOR DEVICE HAVING THREE-DIMENSIONAL STACKED STRUCTURE AND METHOD OF FABRICATING THE SAME

Modular chip integration techniques

Thin semiconductor device package

Wafer of circuit board and joining structure of wafer or circuit board

Flip chip connection structure having powder-like conductive substance and method of producing the same

Wiring substrate and semiconductor device

Semiconductor apparatus, manufacturing method of semiconductor apparatus, and joint material

Semiconductor device and method of manufacturing the same

Stable gold bump solder connections

Die warpage control

Method for exchanging semiconductor chip of flip-chip module and flip-chip module suitable therefor

Semiconductor device and method of forming interconnect structure in non-active area of wafer

Thermo-compression bonded electrical interconnect structure and method

Thermo-compression bonded electrical interconnect structure and method

Flip-chip component production method

Microelectronic package interconnect and method of fabrication thereof

Methods of forming nano-coatings for improved adhesion between first level interconnects and epoxy under-fills in microelectronic packages and structures formed thereby

PACKAGED INTEGRATED CIRCUIT AND METHOD OF FORMING THEREOF

THERMALLY ENHANCED THIN SEMICONDUCTOR PACKAGE

Electronic element that includes multilayered bonding interface between first electrode having aluminum-containing surface and second electrode composed of metal nanoparticle sintered body

Method and apparatus for flip-chip bonding

Method of manufacturing a contact arrangement between a microelectronic component and a carrier

Flip chip package structure and method for manufacturing the same

Electronic device and method of manufacturing same

Method and apparatus for fabricating integrated circuit device using self-organizing function

Method of manufacturing a semiconductor apparatus

Flip-chip package structure, and the substrate and the chip thereof

Flip-Chip Packaging with Stud Bumps

Chip embedded substrate and method of producing the same

Semiconductor device and method for manufacturing thereof

Semiconductor device with flip-chip connection that uses gallium or indium as bonding material

Wafer-level solder bumps

Bonding structure with buffer layer and method of forming the same

Reducing stress in a flip chip assembly

Microelectronic die including locking bump and method of making same

Electronic system with vertical intermetallic compound

Chip scale package having flip chip interconnect on die paddle

Standoff height improvement for bumping technology using solder resist

Method of bonding aluminum electrodes of two semiconductor substrates

Electronic component and manufacturing method therefor

Method for manufacturing semiconductor package

Die stacking system and method

Process and apparatus for wafer-level flip-chip assembly

Wafer-level flip-chip assembly methods

Flip chip laser bonding process

Fabricating process of a chip package structure

Semiconductor device and process for fabricating the same

Low-cost and ultra-fine integrated circuit packaging technique

Semiconductor apparatus, manufacturing method thereof, semiconductor module apparatus using semiconductor apparatus, and wire substrate for semiconductor apparatus

Semiconductor device

Semiconductor device and manufacturing method thereof

Circuitized substrate with internal stacked semiconductor chips, method of making same, electrical assembly utilizing same and information handling system utilizing same

Semiconductor device and manufacturing method thereof

Flip chip semiconductor device including an unconnected neutralizing electrode

Copper die bumps with electromigration cap and plated solder

TEMPORARY CHIP ATTACH USING INJECTION MOLDED SOLDER

Device having a bonding structure for two elements

Wiring substrate and electronic device

Method and device for transferring a chip to a contact substrate

Conductive pattern formation method

Bowed wafer hybridization compensation

Method for forming solder bump and method for mounting semiconductor device using a solder powder resin composition

Component with buried ductile conductive bumps and method of electrical connection between said component and a component equipped with hard conductive points

Semiconductor device and manufacturing method thereof

FLIP CHIP PACKAGE WITH ANTI-FLOATING STRUCTURE

Method for fabrication of a conductive bump structure of a circuit board

Semiconductor device using wiring substrate having a wiring structure reducing wiring disconnection

Electrically conductive interconnect system and method

Semiconductor package and method of manufacturing the same

Methods of stacking semiconductor devices and methods of fabricating semiconductor device packages using the same

Method of making circuitized substrate with solder balls having roughened surfaces, method of making electrical assembly including said circuitized substrate, and method of making multiple circuitized substrate assembly

MICROELECTRONIC DIE INCLUDING SOLDER CAPS ON BUMPING SITES THEREOF AND METHOD OF MAKING SAME

Flip-chip packages allowing reduced size without electrical shorts and methods of manufacturing the same

METHODS OF FORMING STEPPED BUMPS AND STRUCTURES FORMED THEREBY

Methods of forming stepped bumps and structures formed thereby

Semiconductor chip and method of manufacturing semiconductor chip

Flip chip mounting method by no-flow underfill

Mounting method for semiconductor parts on circuit substrate

Microelectronic packages having improved input/output connections and methods therefor

Electric component having microtips and ductile conducting bumps

Semiconductor chip and production process therefor

Stacked structures and methods of fabricating stacked structures

Silica nanoparticles thermoset resin compositions

Semiconductor device with no base member and method of manufacturing the same

Chip and manufacturing method and application thereof

SEMICONDUCTOR CHIP HAVING BUMPS OF DIFFERENT HEIGHTS AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

Manufacturing device of semiconductor package and manufacturing method of semiconductor package

Gold-Tin Solder Joints Having Reduced Embrittlement

Method of assembling carbon nanotube reinforced solder caps

Wire Bump Material

Structure of mounting electronic component

Method of manufacturing a component-embedded printed circuit board

Camera module and assembling process thereof

MOUNTING STRUCTURE OF SEMICONDUCTOR DEVICE HAVING FLUX AND UNDER FILL RESIN LAYER AND METHOD OF MOUNTING SEMICONDUCTOR DEVICE

Composite photoresist for modifying die-side bumps

Flip chip mounting process and flip chip assembly

Device, method of manufacturing device, board, method of manufacturing board, mounting structure, mounting method, LED display, LED backlight and electronic device

High density nanostructured interconnection

MANUFACTURING APPARATUS OF SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

Electronic assemblies and systems with filled no-flow underfill

Temporary chip attach using injection molded solder

Semiconductor module featuring solder balls having lower melting point than that of solder electrode terminals of electronic device containing additional metal powder component

Thin semiconductor device package

Optical display package and the method thereof

Apparatuses and methods to enhance passivation and ILD reliability

Room temperature metal direct bonding

Isolating chip-to-chip contact

Chip package

Method for forming reinforced interconnects on a substrate

Method for diffusion soldering

MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

Wiring board with connection electrode formed in opening and semiconductor device using the same

Flip-Chip Device Having Underfill in Controlled Gap

Processed wafer via

Stacked chip-based system and method

CHIP CONNECTOR

Plurality of devices attached by solder bumps

Integrated circuit package system with leadfinger support

Tooling for coupling multiple electronic chips

Printed circuit board for semiconductor package and method of manufacturing the same

Triaxial through-chip connection

Multi-chip stack package and fabricating method thereof

Semiconductor package and fabricating method thereof

Back-to-front via process

Thermally balanced via

Method for joining electronic parts finished with nickel and electronic parts finished with electroless nickel

Wafer-level processing of chip-packaging compositions including bis-maleimides

Methods including fluxless chip attach processes

Electronic part mounting method

Semiconductor device and its manufacture method capable of preventing short circuit of electrodes when semiconductor device is mounted on sub-mount substrate

Flip-chip mounting substrate and flip-chip mounting method

Microelectronic elements with compliant terminal mountings and methods for making the same

Carbon nanotubes solder composite for high performance interconnect

Method of manufacturing semiconductor device

Coaxial through chip connection

Carbon nanotube reinforced metallic layer

Interconnect structure of an integrated circuit and manufacturing method thereof

Bonding structure with buffer layer and method of forming the same

Pin-type chip tooling

Wiring board, electronic component mounting structure, and electronic component mounting method

Semiconductor Device with Improved Stud Bump

Low Profile Stacking System and Method

Low Profile Stacking System and Method

Method of manufacturing a semiconductor device

Semiconductor device and method for manufacturing the same

Method and apparatus for rapid thermal processing and bonding of materials using RF and microwaves

Semiconductor package with controlled solder bump wetting

Technique for moderating stresses cause by a difference in thermal expansion coeffiecients between a substrate and an electronic component

Semiconductor chip and method of manufacturing semiconductor chip

Electronic device, semiconductor device using same, and method for manufacturing semiconductor device

Contacts to microdevices

Component mounting method and component-mounted body

Bonding structure with buffer layer and method of forming the same

Flip-chip packaging process using copper pillar as bump structure

Chip package and bump connecting structure thereof

Copper bump barrier cap to reduce electrical resistance

Display panel package

Methods and apparatus for high-density chip connectivity

Method and apparatus for flip-chip bonding

No flow underfill device and method

Methods of bonding two semiconductor devices

Packaging method

Etch stop layer for silicon (Si) via etch in three-dimensional (3-D) wafer-to-wafer vertical stack

Method of manufacturing electronic circuit device

Method and structure for interfacing electronic devices

Method for mounting electronic element on a circuit board

Temperature dependent semiconductor module connectors

Soldering a die to a substrate

Method and apparatus for bonding wafers

Semiconductor device

Coaxial through chip connection

Post-attachment chip-to-chip connection

Rigid-backed, membrane-based chip tooling

Through chip connection

Chip-based thermo-stack

Non-contact ID card and manufacturing method thereof

Substrate for pre-soldering material and fabrication method thereof

Inverse chip connector

Chip connector

Post & penetration interconnection

Triaxial through-chip connection

Profiled contact

Patterned contact

Contact-based encapsulation

Membrane-based chip tooling

Microelectronic assemblies having low profile connections

Locking mechanism for die assembly

Stacked chip security

Method of bonding a microelectronic die to a substrate and arrangement to carry out method

Metrology system and method for stacked wafer alignment

Flip chip method

Semiconductor package with controlled solder bump wetting and fabrication method therefor

Semiconductor device and method of manufacturing the same

Microelectronic package interconnect and method of fabrication thereof

Method for fabricating a flip chip package

Multilayer circuit board and method of manufacturing the same

Packing method for electronic components

Chip package with dam bar restricting flow of underfill

Flip chip interconnection having narrow interconnection sites on the substrate

Manufacturing method for semiconductor device, semiconductor device, and electronic apparatus

Wiring board, electronic circuit board, electronic apparatus and manufacturing method of electronic circuit board

Devices having compliant wafer-level input/output interconnections and packages using pillars and methods of fabrication thereof

Holder for electronic component, holding sheet for electronic component, electronic module using holder, electronic module using holding sheet, lamination of electronic modules, method for manufacturing electronic module, and method for testing electronic module

Temperature dependent semiconductor module connectors

Conductive bump structure of circuit board and method for fabricating the same

FINE PAD PITCH ORGANIC CIRCUIT BOARD WITH PLATING SOLDER AND METHOD FOR FABRICATING THE SAME

Semiconductor flip chip package having substantially non-collapsible spacer

Chip scale package having flip chip interconnect on die paddle

Dual metal stud bumping for flip chip applications

System for testing semiconductor components having interconnect with variable flexure contacts

Semiconductor device and process for producing the same

Electronic device and method for fabricating the same

Thin film transistor substrate, method of manufacturing the same, liquid crystal display apparatus having the same and method of manufacturing the liquid crystal display apparatus

Hot-Melt Underfill Composition and Methos of Application

Hyper thermally enhanced semiconductor package system comprising heat slugs on opposite surfaces of a semiconductor chip

Repairable three-dimensional semiconductor subsystem

Flip chip package with anti-floating structure

Hermetically sealing using a cold welded tongue and groove structure

Reinforced solder bump structure and method for forming a reinforced solder bump

Integrated circuit package and assembly thereof

Integrated circuit component and mounting method thereof

Flexible wiring substrate, semiconductor device and electronic device using flexible wiring substrate, and fabricating method of flexible wiring substrate

Interconnect including a pliable surface and use thereof

Structure of mounting electronic component

Rfid tag

Method of fabricating microelectronic package using no-flow underfill technology and microelectronic package formed according to the method

Flat chip semiconductor device and manufacturing method thereof

Manufacturing method of semiconductor device

No-flow underfill composition and method

Semiconductor device, semiconductor device module and method of manufacturing the semiconductor device

Methods of bonding two semiconductor devices

Semiconductor test interconnect with variable flexure contacts having polymer material

Stud bump socket

Integrated circuit packages with reduced stress on die and associated methods

Mounting with auxiliary bumps

Semiconductor package having a first conductive bump and a second conductive bump and methods for manufacturing the same

High density nanostructured interconnection

Mounting substrate and mounting method of electronic part

Semiconductor apparatus, manufacturing method thereof, semiconductor module apparatus using semiconductor apparatus, and wire substrate for semiconductor apparatus

Microelectronic device interconnects

Package structure with two solder arrays

Two solder array structure with two high melting solder joints

Semiconductor device and manufacturing method thereof

LSI package, LSI element testing method, and semiconductor device manufacturing method

Method and structure for interfacing electronic devices

Circuit substrate for packaging semiconductor device, method for producing the same, and method for producing semiconductor device package structure using the same

Room temperature metal direct bonding

Materials for electronic devices

Wafer-level assembly method for chip-size devices having flipped chips

Method for producing an electronic device connected to a printed circuit board

Electronic circuit device having circuit board electrically connected to semiconductor element via metallic plate

Low profile stacking system and method

Method of manufacturing a semiconductor device

Focal plane arrays in type II-superlattices

Bonding structure with buffer layer and method of forming the same

Flip chip device having supportable bar and mounting structure thereof

Semiconductor device and its manufacture method capable of preventing short circuit of electrodes when semiconductor device is mounted on sub-mount substrate

Wafer-level package and its manufacturing method

Electronic device with reduced entrapment of material between die and substrate electrical connections

No-flow underfill composition and method

Stacked package module

Large bumps for optical flip chips

Large bumps for optical flip chips

Deposition of diffusion barrier

Printed circuit board unit with detachment mechanism for electronic component

Electrical circuit assembly with micro-socket

Substrate for pre-soldering material and fabrication method thereof

Bonded structure using conductive adhesives, and a manufacturing method thereof

Manufacturing method for semiconductor device, semiconductor device, and electronic apparatus

Method of bonding semiconductor devices

Reconnectable chip interface and chip package

Reconnectable chip interface and chip package

Method of fabricating an electronic device

Electronic devices and methods for making same using nanotube regions to assist in thermal heat-sinking

Microwave integrated quantum circuits with cap wafers and their methods of manufacture

Microwave integrated quantum circuits with cap wafers and their methods of manufacture

Temporary bonding structures for die-to-die and wafer-to-wafer bonding

Joint structure for metal pillars