Semiconductor device and method of manufacturing semiconductor device

Method for manufacturing printed wiring board

Electronic assemblies including mechanically secured protruding bonding conductor joints

BONDING PAD STRUCTURE AND INTEGRATED CIRCUIT COMPRISING A PLURALITY OF BONDING PAD STRUCTURES

Interconnect structure

Semiconductor device and method of manufacturing the same

SOLDERING CONNECTING PIN, SEMICONDUCTOR PACKAGE SUBSTRATE AND METHOD OF MOUNTING SEMICONDUCTOR CHIP USING THE SAME

Semiconductor Device with Cross-shaped Bumps and Test Pads Alignment

Film for the backside of flip-chip type semiconductor, dicing tape-integrated film for the backside of semiconductor, method of manufacturing film for the backside of flip-chip type semiconductor, and semiconductor device

AIRTIGHT ASSEMBLY OF TWO COMPONENTS AND METHOD FOR PRODUCING SUCH AN ASSEMBLY

Semiconductor device

PROCESS AND APPARATUS FOR MANUFACTURING SEMICONDUCTOR DEVICE

Method for wafer bonding using gold and indium

Bonding process and bonded structures

Thermal compressive bonding with separate die-attach and reflow processes

Electronic element unit and reinforcing adhesive agent

Adhesive composition, adhesive sheet, semiconductor apparatus protection material, and semiconductor apparatus

ELECTRICALLY CONDUCTIVE INTERCONNECT SYSTEM AND METHOD

Semiconductor device, method for manufacturing semiconductor device, and circuit device using semiconductor device

CHIP-ON-CHIP STRUCTURE AND MANUFACTURING METHOD THEROF

No flow underfill

Method of manufacturing a flip chip package and apparatus to attach a semiconductor chip used in the method

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR

Test structures for through silicon vias (TSVs) of three dimensional integrated circuit (3DIC)

Bonding process and bonded structures

Semiconductor packages and methods of fabricating the same

Copper pillar bump with cobalt-containing sidewall protection

Method of manufacturing semiconductor device

ELECTRONIC DEVICE, CIRCUIT BOARD, AND MANUFACTURING METHOD OF ELECTRONIC DEVICE

Bonding process and bonded structures

Semiconductor element, semiconductor element mounted board, and method of manufacturing semiconductor element

SEMICONDUCTOR PACKAGES, ELECTRONIC DEVICES AND ELECTRONIC SYSTEMS EMPLOYING THE SAME

Integrated circuit packaging system with stack interconnect and method of manufacture thereof

Apparatus and methods for high-density chip connectivity

Semiconductor device

Method for manufacturing electronic component, and electronic component

Layered chip package and method of manufacturing same

Embedded package and method for manufacturing the same

SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME

Semiconductor device and method of forming vertically offset conductive pillars over first substrate aligned to vertically offset BOT interconnect sites formed over second substrate

Mechanisms for forming copper pillar bumps using patterned anodes

Method of manufacturing and assembling semiconductor chips with offset pads

Semiconductor integrated circuit device

Thermally releasable sheet-integrated film for semiconductor back surface, method of collecting semiconductor element, and method of producing semiconductor device

FILM FOR FLIP CHIP TYPE SEMICONDUCTOR BACK SURFACE AND ITS USE

Film for flip chip type semiconductor back surface containing thermoconductive filler

Microelectronic packages with nanoparticle joining

Method and apparatus for manufacturing three-dimensional integrated circuit

Forming low stress joints using thermal compress bonding

FILM FOR FLIP CHIP TYPE SEMICONDUCTOR BACK SURFACE, AND DICING TAPE-INTEGRATED FILM FOR SEMICONDUCTOR BACK SURFACE

Film for flip chip type semiconductor back surface, dicing tape-integrated film for semiconductor back surface, process for producing semiconductor device, and flip chip type semiconductor device

Doping minor elements into metal bumps

Thermal compress bonding

Layered chip package and method of manufacturing same

Conductive sidewall for microbumps

Recessed pillar structure

Substrate stand-offs for semiconductor devices

Microelectronic packages with dual or multiple-etched flip-chip connectors

METHOD AND SYSTEM FOR ALIGNMENT OF INTEGRATED CIRCUITS

METHODS OF FORMING THROUGH-SILICON VIA STRUCTURES INCLUDING CONDUCTIVE PROTECTIVE LAYERS

Electronic device comprising a nanotube-based interface connection layer, and manufacturing method thereof

Method of mounting electronic component and mounting substrate

Layered chip package and method of manufacturing same

Metal coating for indium bump bonding

Module substrate with feature for replacement of faulty chips, semiconductor module having the same, and method for manufacturing the semiconductor module

Stacked semiconductor device with through via

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH FLIP CHIP MOUNTING AND METHOD OF MANUFACTURE THEREOF

Copper bump structures having sidewall protection layers

Wafer level processing method and structure to manufacture semiconductor chip

Method for Making Die Assemblies

Semiconductor device

Multi-chip package with pillar connection

Cu pillar bump with non-metal sidewall spacer and metal top cap

Semiconductor wafer structure and multi-chip stack structure

Semiconductor wafer structure and multi-chip stack structure

Strength of micro-bump joints

Process for improving package warpage and connection reliability through use of a backside mold configuration (BSMC)

Substrate interconnections having different sizes

Controlling Solder Bump Profiles by Increasing Heights of Solder Resists

Cu pillar bump with L-shaped non-metal sidewall protection structure

Magnetic microelectronic device attachment

Semiconductor device, method for manufacturing the same, and electronic device

Semiconductor device and method of forming a vertical interconnect structure for 3-D FO-WLCSP

Semiconductor device

MAGNETIC PARTICLE ATTACHMENT MATERIAL

Method and apparatus for rapid thermal processing and bonding of materials using RF and microwaves

PATTERNED CONTACT

Hermetic wafer-to-wafer bonding with electrical interconnection

HERMETIC WAFER-TO-WAFER BONDING WITH ELECTRICAL INTERCONNECTION

Biocompatible Bonding Method

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Cu pillar bump with non-metal sidewall protection structure

Magnetic intermetallic compound interconnect

Flip chip interconnection structure

Chip embedded substrate and method of producing the same

Die structure and die connecting method

Method for fabricating bump structure without UBM undercut

Semiconductor device and method of forming electrical interconnection between semiconductor die and substrate with continuous body of solder tape

Inverse chip connector

METHOD AND APPARATUS FOR FABRICATING INTEGRATED CIRCUIT DEVICE USING SELF-ORGANIZING FUNCTION

Reduction of mechanical stress in metal stacks of sophisticated semiconductor devices during die-substrate soldering by an enhanced cool down regime

EPOXY RESIN COMPOSITION FOR SEALING PACKING OF SEMICONDUCTOR, SEMICONDUCTOR DEVICE, AND MANUFACTURING METHOD THEREOF

Thermo-compression bonded electrical interconnect structure and method

Sacrificial material to facilitate thin die attach

Semiconductor device and semiconductor device manufacturing method

Semiconductor chip with a rounded corner

Alignment structures for integrated-circuit packaging

ROOM TEMPERATURE DIRECT METAL-METAL BONDING

Electronic component package and method for producing electronic component package

Pin-type chip tooling

Method of manufacturing electronic device and electronic device

Method of manufacturing electronic apparatus, electronic component-mounting board, and method of manufacturing the same

Ferroelectric component and manufacturing the same

Flux-free chip to substrate joint serial linear thermal processor arrangement

Dummy wafers in 3DIC package assemblies

Rigid-backed, membrane-based chip tooling

ULTRA THIN FLIP-CHIP BACKSIDE DEVICE SENSOR PACKAGE

Semiconductor device and process for fabricating the same

Flux-free chip to wafer joint serial thermal processor arrangement

Systems and Methods Providing Arrangements of Vias

Package assembly including a semiconductor substrate in which a first portion of a surface of the semiconductor substrate is recessed relative to a second portion of the surface of the semiconductor substrate to form a recessed region in the semiconductor substrate

Recessed semiconductor substrates and associated techniques

T-shaped post for semiconductor devices

TECHNIQUES AND CONFIGURATIONS FOR RECESSED SEMICONDUCTOR SUBSTRATES

Stable Gold Bump Solder Connections

Semiconductor device manufacturing method

Wiring substrate, manufacturing method thereof, and semiconductor package

REAL TIME MONITORING OF INDIUM BUMP REFLOW AND OXIDE REMOVAL ENABLING OPTIMIZATION OF INDIUM BUMP MORPHOLOGY

PB-free solder bumps with improved mechanical properties

Wiring board, semiconductor device and method for manufacturing the same

Use of die backside films to modulate EOL coplanarity of thin packages while providing thermal capability and laser markability of packages

Dicing tape-integrated film for semiconductor back surface

Film for flip chip type semiconductor back surface

Film for flip chip type semiconductor back surface

Overcoming laminate warpage and misalignment in flip-chip packages

Contact-based encapsulation

Solder in cavity interconnection technology

Structure, electronic device, and method for fabricating a structure

Substrate for electronic device, stack for electronic device, electronice device, and method for manufacturing the same

Integrated circuit chip with pyramid or cone-shaped conductive pads for flexible C4 connections and a method of forming the integrated circuit chip

Bonding structure and method for manufacturing same

Wiring board, manufacturing method of the wiring board, and semiconductor package

Semiconductor Device and Method of Confining Conductive Bump Material with Solder Mask Patch

Wiring circuit structure and manufacturing method for semiconductor device using the structure

First-level interconnects with slender columns, and processes of forming same

EPOXY RESIN FORMULATIONS FOR UNDERFILL APPLICATIONS

Bumping free flip chip process

Metal nanoink and process for producing the metal nanoink, and die bonding method and die bonding apparatus using the metal nanoink

Circuit board and chip package structure

Stable gold bump solder connections

Semiconductor flip chip package having substantially non-collapsible spacer and method of manufacture thereof

ELECTRONIC CHIP AND SUBSTRATE PROVIDING INSULATION PROTECTION BETWEEN CONDUCTING NODES

Copper bump joint structures with improved crack resistance

Robust joint structure for flip-chip bonding

Semiconductor package, method of evaluating same, and method of manufacturing same

Thermo-compression bonded electrical interconnect structure

Method of making a connection component with hollow inserts

Non-uniform alignment of wafer bumps with substrate solders

Surface modification for handling wafer thinning process

Method of manufacturing substrate for flip chip and substrate for flip chip manufactured using the same

Electronic assemblies including mechanically secured protruding bonding conductor joints

Die stacking system and method

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE FABRICATION METHOD

Method for manufacturing semiconductor device

Flip chip interconnection with double post

Semiconductor device and method of forming bump-on-lead interconnection

Apparatus and methods of forming an interconnect between a workpiece and substrate

Semiconductor device and method of forming flipchip interconnect structure

SEMICONDUCTOR DEVICE AND METHOD FOR MOUNTING SEMICONDUCTOR DEVICE

Method of manufacturing semiconductor device, semiconductor device and multilayer wafer structure

STACKED SEMICONDUCTOR DEVICE AND A METHOD FOR MANUFACTURING THE SAME

METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE

Method of attaching a solder ball and method of repairing a memory module

METHOD OF FABRICATING A SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PRODUCTION EQUIPMENT

Bonding metallurgy for three-dimensional interconnect

Semiconductor device and method of manufacturing the same

Semiconductor Chip with Stair Arrangement Bump Structures

Fabrication method of package structure

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR DEVICE

Flip-Chip Package Structure

Semiconductor wafer-to-wafer bonding for dissimilar semiconductor dies and/or wafers

Composite semiconductor structure formed using atomic bonding and adapted to alter the rate of thermal expansion of a substrate

Room temperature metal direct bonding

Method of manufacturing semiconductor device

Method of manufacturing semiconductor component, and semiconductor component

Method for bonding two electronic components

Semiconductor package and method of manufacturing the same

Leadframe feature to minimize flip-chip semiconductor die collapse during flip-chip reflow

Post bump and method of forming the same

Method of plasma preparation of metallic contacts to enhance mechanical and electrical integrity of subsequent interconnect bonds

STRUCTURE OF A PACKAGE FOR ELECTRONIC DEVICES AND METHOD FOR MANUFACTURING THE PACKAGE

Method and structure for adhesion of intermetallic compound (IMC) on Cu pillar bump

Formation of TSV backside interconnects by modifying carrier wafers

Stacked structures and methods of fabricating stacked structures

Semiconductor device and method for manufacturing the same

Method for manufacturing semiconductor device

Copper pillar bonding for fine pitch flip chip devices

Electrical connection and method of manufacturing the same

INTERPOSER SUBSTRATE, LSI CHIP AND INFORMATION TERMINAL DEVICE USING THE INTERPOSER SUBSTRATE, MANUFACTURING METHOD OF INTERPOSER SUBSTRATE, AND MANUFACTURING METHOD OF LSI CHIP

Method for manufacturing hetero-bonded wafer

Processed wafer via

Semiconductor device

Modified Pillar Design for Improved Flip Chip Packaging

Method of fabricating stacked semiconductor chips

Wiring substrate and semiconductor device having connection pads formed in non-solder mask defined structure

Semiconductor package and manufacturing method of the semiconductor package

Stack structure with copper bumps

Semiconductor device and method to manufacture thereof

Wafer backside structures having copper pillars

Backside process for a substrate

Circuit device, method of manufacturing the circuit device, device mounting board and semiconductor module

Methods of fluxless micro-piercing of solder balls, and resulting devices

Semiconductor Manufacturing Method

Self-Aligned Chip Stacking

Interconnect structure and a method of fabricating the same

Electronic component with mechanically decoupled ball connections

Flip chip semiconductor package and fabrication method thereof

Method for manufacturing printed wiring board and printed wiring board

CHIP PACKAGE STRUCTURE

Coaxial through chip connection

Electronic member, electronic part and manufacturing method therefor

Flip chip interconnection having narrow interconnection sites on the substrate

Semiconductor device and method of manufacturing the same

Semiconductor device and method of fabricating the same

Detection device and method for manufacturing the same

THERMOELECTRIC DEVICE AND FABRICATION METHOD THEREOF, CHIP STACK STRUCTURE, AND CHIP PACKAGE STRUCTURE

Attachment using magnetic particle based solder composites

Fabrication method of circuit board

Face-to-face (F2F) hybrid structure for an integrated circuit

Thermally enhanced thin semiconductor package

Fabricating process of a chip package structure

Flip chip mounting process and flip chip assembly

Semiconductor device and method for fabricating the same

CIRCUIT SUBSTRATE, CIRCUIT MODULE AND METHOD FOR MANUFACTURING THE CIRCUIT SUBSTRATE

Circuit substrate and circuit substrate manufacturing method

Method of forming bump structure having tapered sidewalls for stacked dies

Semiconductor device, and method of manufacturing multilayer wiring board and semiconductor device

Manufacturing method of semiconductor device, and semiconductor device

Semiconductor integrated circuit device

Carbon nanotubes solder composite for high performance interconnect

Interconnect and method for mounting an electronic device to a substrate

Method of preparing detectors for oxide bonding to readout integrated chips

Adhesive film, connecting method, and joined structure

WIRING BOARD WITH BUILT-IN ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME

Through-silicon via structures providing reduced solder spreading and methods of fabricating the same

Semiconductor device and method of manufacturing the same

Electronic device and method for fabricating the same

Carbon nanotube-reinforced solder caps, and chip packages and systems containing same

Very small pixel pitch focal plane array and method for manufacturing thereof

Connection by fitting together two soldered inserts

SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING SAME AND METHOD OF REPAIRING SAME

Crystal structure of a solder bump of flip chip semiconductor device

PACKAGE STRUCTURE AND PACKAGE SUBSTRATE

Through silicon via bonding structure

Through-silicon via structures including conductive protective layers

Semiconductor package and manufacturing method thereof

Standoff height improvement for bumping technology using solder resist

Under bump metallization for on-die capacitor

Conductive nanowires for electrical interconnect

Bonding metallurgy for three-dimensional interconnect

Solder Interconnect

INTEGRATED CIRCUIT DEVICE WITH IMPROVED UNDERFILL COVERAGE

Production method of semiconductor device and bonding film

Methods for fabricating fine line/space (FLS) routing in high density interconnect (HDI) substrates

Apparatuses and methods to enhance passivation and ILD reliability

Microelectronic package with self-heating interconnect

Semiconductor chip assembly

Semiconductor device having substrate with differentially plated copper and selective solder

Semiconductor device and method of manufacturing semiconductor device

Wiring board

Apparatus and methods of forming an interconnect between a workpiece and substrate

Electronic carrier board

Chip-based thermo-stack

Fixture for P-through silicon via assembly

SEMICONDUCTOR PACKAGE WITH STACKED DIE ASSEMBLY

METHOD AND APPARATUS FOR RAPID THERMAL PROCESSING AND BONDING OF MATERIALS USING RF AND MICROWAVES

Flip-chip mounting substrate and flip-chip mounting method

SUBSTRATE FOR MOUNTING ELECTRONIC COMPONENTS AND ITS METHOD OF MANUFACTURE

Thermal interface material for combined reflow

Methods to Form a Three-Dimensionally Curved Pad in a Substrate and Integrated Circuits Incorporating such a Substrate

Semiconductor device and fabrication method thereof

Wiring board with built-in electronic component and method of manufacturing same

Bump bonding method

Method of manufacturing wiring substrate and method of manufacturing semiconductor device

Semiconductor Device Having High-Density Interconnect Array with Core Pillars Formed With OSP Coating

Method of manufacturing wiring board having a semiconductor thereon

POLYMER AND SOLDER PILLARS FOR CONNECTING CHIP AND CARRIER

Dual metal stud bumping for flip chip applications

Post bump and method of forming the same

Wiring board and method of manufacturing the same

Integrated circuit package system with leadfinger support

Semiconductor device and method of manufacturing the same

Electronic apparatus manufacturing method

Conductive ball mounting method and surplus ball removing apparatus

Methods of fluxless micro-piercing of solder balls, and resulting devices

Wiring substrate and electronic component mounting structure

Method of fabricating semiconductor device having three-dimensional stacked structure

Flip chip interconnection with double post

Isolating chip-to-chip contact

METHOD OF FORMING CONDUCTIVE BUMPS