211013 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector; Applying energy for connecting; Compression bonding applying unidirectional static pressure
SOLDER CREEP LIMITING RIGID SPACER FOR STACKED DIE C4 PACKAGING
#2SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
#3ROOM TEMPERATURE METAL DIRECT BONDING
#4Methods of fluxless micro-piercing of solder balls, and resulting devices
#5Assembly comprising hybrid interconnecting means including intermediate interconnecting elements and sintered metal joints, and manufacturing process
#6ELECTRONIC DEVICE, ELECTRONIC DEVICE MANUFACTURING METHOD, AND ELECTRONIC APPARATUS
#7Electronic device and method for producing an electronic device
#8High quality electrical contacts between integrated circuit chips
#9Semiconductor device and method of self-confinement of conductive bump material during reflow without solder mask
#10Method of producing a hybridized device including microelectronic components
#11Room temperature metal direct bonding
#12Semiconductor device and method of forming bump-on-lead interconnection
#13Flip-chip bonding method and solid-state image pickup device manufacturing method characterized in including flip-chip bonding method
#14Semiconductor device and method of self-confinement of conductive bump material during reflow without solder mask
#15METALLURGICAL CLAMSHELL METHODS FOR MICRO LAND GRID ARRAY FABRICATION
#16Methods of fluxless micro-piercing of solder balls, and resulting devices
#17Room temperature metal direct bonding
#18Semiconductor device and method of confining conductive bump material with solder mask patch
#19Method for manufacturing electronic device and electronic device
#20GOLD BONDING IN SEMICONDUCTOR DEVICES USING POROUS GOLD
#21Semiconductor device and method of forming bump-on-lead interconnection
#22SEMICONDUCTOR DEVICE AND METHOD OF FORMING BUMP-ON-LEAD INTERCONNECTION
#23Room temperature metal direct bonding
#24Process for forming packages
#25Metallurgical clamshell methods for micro land grid array fabrication
#26Manufacturing method including deformation of supporting board to accommodate semiconductor device
#27Semiconductor device and method of confining conductive bump material with solder mask patch
#28Semiconductor Device and Method of Forming Narrow Interconnect Sites on Substrate with Elongated Mask Openings
#29Interconnect assemblies and methods of making and using same
#30Joining method and device produced by this method and joining unit
#31Methods and systems for material bonding
#32Semiconductor Device and Method of Confining Conductive Bump Material with Solder Mask Patch
#33Metallurgical clamshell methods for micro land grid array fabrication
#34Method of making a connection component with hollow inserts
#35Semiconductor device and method of self-confinement of conductive bump material during reflow without solder mask
#36Semiconductor device and method of forming narrow interconnect sites on substrate with elongated mask openings
#37Method for manufacturing semiconductor device
#38Semiconductor device and method of forming bump-on-lead interconnection
#39Composite semiconductor structure formed using atomic bonding and adapted to alter the rate of thermal expansion of a substrate
#40Room temperature metal direct bonding
#41Method of manufacturing semiconductor component, and semiconductor component
#42Method for producing substrate for mounting device and method for producing a semiconductor module
#43Semiconductor device
#44High quality electrical contacts between integrated circuit chips
#45Methods of fluxless micro-piercing of solder balls, and resulting devices
#46Manufacture method for semiconductor device with bristled conductive nanotubes
#47Joining method and device produced by this method and joining unit
#48IC chip package employing substrate with a device hole
#49SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SEMICONDUCTOR DEVICE
#50Chip Mounting Apparatus and Chip Mounting Method
#51Chip-based thermo-stack
#52Micropad formation for a semiconductor
#53SUBSTRATE FOR MOUNTING DEVICE AND METHOD FOR PRODUCING THE SAME, SEMICONDUCTOR MODULE AND METHOD FOR PRODUCING THE SAME, AND PORTABLE APPARATUS PROVIDED WITH THE SAME
#54Methods of fluxless micro-piercing of solder balls, and resulting devices
#55Semiconductor device and method of manufacturing the same
#56Semiconductor device and method for mounting semiconductor chip
#57Method of bonding aluminum electrodes of two semiconductor substrates
#58Joining method and device produced by this method and joining unit
#59Method for manufacturing semiconductor device
#60Method of manufacturing semiconductor chip assembly with sacrificial metal-based core carrier
#61Flip chip mounting method by no-flow underfill having level control function
#62Electric component having microtips and ductile conducting bumps
#63Methods for attaching microfeature dies to external devices
#64Room temperature metal direct bonding
#65Method of soldering or brazing articles having surfaces that are difficult to bond
#66Chip-based thermo-stack
#67Method of fabricating microelectronic package using no-flow underfill technology and microelectronic package formed according to the method
#68Manufacturing apparatus of semiconductor devices, and method of manufacturing semiconductor devices
#69Manufacturing method of semiconductor device
#70Lead-free bonding systems
#71Room temperature metal direct bonding
#72Semiconductor device
#73Electronic circuit device and porduction method therefor
#74Semiconductor package