211042 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector; Bonding interfaces outside the semiconductor or solid-state body; Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of greater than 1550°C
BRIDGE INTERCONNECTION WITH LAYERED INTERCONNECT STRUCTURES
#2Bridge interconnection with layered interconnect structures
#3Bridge interconnection with layered interconnect structures
#4Bridge interconnection with layered interconnect structures
#5Bridge interconnection with layered interconnect structures
#6Bonding structure for semiconductor package and method of manufacturing the same
#7Bridge interconnection with layered interconnect structures
#8Integrated circuit device having die bonded to the polymer side of a polymer substrate