H01L2224/81399 - CPC Classification

Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector; Bonding interfaces outside the semiconductor or solid-state body Material

• H01L2224/814 » with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof 159
• H01L2224/81486 » with a principal constituent of the material being a non metallic, non metalloid inorganic material 3
• H01L2224/8149 » with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy 16
• H01L2224/81493 » with a principal constituent of the material being a solid not provided for in groups to , e.g. allotropes of carbon, fullerene, graphite, carbon-nanotubes, diamond 10
• H01L2224/81494 » with a principal constituent of the material being a liquid not provided for in groups to 1
• H01L2224/81495 » with a principal constituent of the material being a gas not provided for in groups to 0
• H01L2224/81498 » with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material, e.g. segmented structures, foams 0

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