211045 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector; Bonding interfaces outside the semiconductor or solid-state body; Material with a principal constituent of the material being a non metallic, non metalloid inorganic material Glasses, e.g. amorphous oxides, nitrides or fluorides
Anisotropic conductive film, method for producing anisotropic conductive film, method for producing connection body, and connection method
#2Anisotropic conductive film and production method of the same
#3Anisotropic conductive film and production method of the same
#4Connection body
#5Connection body, method for manufacturing a connection body, connecting method and anisotropic conductive adhesive agent
#6Anisotropic conductive film, method for producing anisotropic conductive film, method for producing connection body, and connection method