211046 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector; Bonding interfaces outside the semiconductor or solid-state body; Material with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
Sub-classes:SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREFOR
#2SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREFOR
#3Substrate structure with selective surface finishes for flip chip assembly
#4Wiring substrate and semiconductor device
#5Substrate structure with selective surface finishes for flip chip assembly
#6Contact smart card
#7Methods of forming flip chip systems
#8Support member, wiring substrate, method for manufacturing wiring substrate, and method for manufacturing semiconductor package
#9Wiring substrate and semiconductor device
#10Chip packaging method and chip package using hydrophobic surface
#11Wiring board
#12Package carrier and manufacturing method thereof
#13Electronic module allowing fine tuning after assembly
#14Semiconductor device manufacturing method
#15Mounted structure and manufacturing method of mounted structure
#16Semiconductor device