211048 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector; Bonding interfaces outside the semiconductor or solid-state body; Material with a principal constituent of the material being a solid not provided for in groups - , e.g. allotropes of carbon, fullerene, graphite, carbon-nanotubes, diamond
CHIP PACKAGE STRUCTURE WITH NICKEL LAYER
#2Chip package structure with nickel layer
#3Chip package structure with conductive adhesive layer
#4Chip package structure with conductive adhesive layer and method for forming the same
#5Chip packaging method and chip package using hydrophobic surface
#6Electronic module allowing fine tuning after assembly
#7TWO-SOLDER METHOD FOR SELF-ALIGNING SOLDER BUMPS IN SEMICONDUCTOR ASSEMBLY
#8Carbon nanotube structures for enhancement of thermal dissipation from semiconductor modules
#9Structure, electronic device, and method for fabricating a structure
#10Carbon nanotube structures for enhancement of thermal dissipation from semiconductor modules
#11High-speed RFID tag assembly using impulse heating
#12High-speed RFID tag assembly using impulse heating