211060 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector; Bonding techniques; Soldering or alloying; Diffusion bonding Solid-liquid interdiffusion
SEMICONDUCTOR PACKAGES WITH AN INTERMETALLIC LAYER
#2SEMICONDUCTOR PACKAGES WITH AN INTERMETALLIC LAYER
#3Advanced Device Assembly Structures And Methods
#4Semiconductor package and manufacturing method thereof
#5Diffusion soldering preform with varying surface profile
#6Advanced device assembly structures and methods
#7Hybrid bonding structures, semiconductor devices having the same, and methods of manufacturing the semiconductor devices
#8Semiconductor packages with an intermetallic layer
#9Connector structure and method of forming same
#10WAFER STACKING FOR INTEGRATED CIRCUIT MANUFACTURING
#11Connector structure and method of forming same
#12Die encapsulation in oxide bonded wafer stack
#13Multiple plated via arrays of different wire heights on same substrate
#14High density multi-component packages
#15Die encapsulation in oxide bonded wafer stack
#16Multiple bond via arrays of different wire heights on a same substrate
#17Tooling for coupling multiple electronic chips
#18Wafer stacking for integrated circuit manufacturing
#19METHOD OF BONDING A FIRST SUBSTRATE AND A SECOND SUBSTRATE
#20Three-dimensional chip stack and method of forming the same
#21Connector structure and method of forming same
#22Semiconductor packages with an intermetallic layer
#23Flip chip bonding alloys
#24Conductive connections, structures with such connections, and methods of manufacture
#25Tooling for coupling multiple electronic chips
#26Die stacks with one or more bond via arrays of wire bond wires and with one or more arrays of bump interconnects
#27Three-dimensional chip stack and method of forming the same
#28Methods of forming semiconductor packages with an intermetallic layer comprising tin and at least one of silver, copper or nickel
#29Method of bonding with silver paste
#30Multiple bond via arrays of different wire heights on a same substrate
#31Multiple bond via arrays of different wire heights on a same substrate
#32Method of manufacturing a chip package
#33Conductive connections, structures with such connections, and methods of manufacture
#34Die stacks with one or more bond via arrays of wire bond wires and with one or more arrays of bump interconnects
#35Three-dimensional chip stack and method of forming the same
#36Junction structure for an electronic device and electronic device
#37Mounting structure and manufacturing method for same
#38Advanced device assembly structures and methods
#39Method for fabricating two substrates connected by at least one mechanical and electrically conductive connection and structure obtained
#40Mounting structure of electronic component with joining portions and method of manufacturing the same
#41Package structure and substrate bonding method
#42Method and system for ultra miniaturized packages for transient voltage suppressors
#43PATTERNED CONTACT
#44Manufacturing method for electronic devices
#45Inverse chip connector
#46Semiconductor device and semiconductor device manufacturing method
#47Pin-type chip tooling
#48Rigid-backed, membrane-based chip tooling
#49Contact-based encapsulation
#50Manufacturing method for electronic devices
#51Coaxial through chip connection
#52LOW STRESS, LOW-TEMPERATURE METAL-METAL COMPOSITE FLIP CHIP INTERCONNECT
#53Methods for bonding and micro-electronic devices produced according to such methods
#54Manufacturing method for electronic devices
#55Semiconductor device with flip-chip connection that uses gallium or indium as bonding material
#56Materials for use with interconnects of electrical devices and related methods
#57Semiconductor module featuring solder balls having lower melting point than that of solder electrode terminals of electronic device containing additional metal powder component
#58Method for diffusion soldering
#59CHIP CONNECTOR
#60Tooling for coupling multiple electronic chips
#61Electronic part mounting method
#62Method of manufacturing semiconductor device
#63Coaxial through chip connection
#64Pin-type chip tooling
#65Interconnecting element between semiconductor chip and circuit support and method
#66Methods for bonding and micro-electronic devices produced according to such methods
#67Coaxial through chip connection
#68Post-attachment chip-to-chip connection
#69Rigid-backed, membrane-based chip tooling
#70Through chip connection
#71Inverse chip connector
#72Chip connector
#73Profiled contact
#74Patterned contact
#75Contact-based encapsulation
#76Membrane-based chip tooling
#77Film circuit substrate having Sn-In alloy layer
#78Method of manufacturing electric device
#79In-situ alloyed solders, articles made thereby, and processes of making same
#80Method of semiconductor device assembly including fatigue-resistant ternary solder alloy
#81[METHOD OF FORMING BOND MICROSTRUCTURE]