211062 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector; Bonding techniques Sintering
POWER-ELECTRONICS PACKAGING, INTERFACE AND CONFIGURATION
#2ELECTRONIC CHIP WITH CONNECTING PILLARS FOR SINTERING ASSEMBLY
#3LOW PRESSURE SINTERING POWDER
#4POWER MODULE PACKAGE AND MANUFACTURE METHOD THEREOF
#5ULTRAFINE-PITCH ALL-COPPER INTERCONNECT STRUCTURE AND FORMING METHOD THEREOF
#6Joining and Insulating Power Electronic Semiconductor Components
#7SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
#8DOUBLE-SIDED HEAT DISSIPATION POWER SEMICONDUCTOR MODULE AND METHOD OF MANUFACTURING THE SAME
#9Interconnect structure for semiconductor with ultra-fine pitch and forming method thereof
#10Sintering a nanoparticle paste for semiconductor chip join
#11Semiconductor device and method for manufacturing the same
#12Tapeless leadframe package with exposed integrated circuit die
#13Low pressure sintering powder
#14Low temperature hybrid bonding structures and manufacturing method thereof
#15System and method for extreme performance die attach
#16Die stack assembly using an edge separation structure for connectivity through a die of the stack
#17Conductive paste having dilatancy, electrode connection structure including the paste, and method for producing the structure
#18Chip packages with sintered interconnects formed out of pads
#19Method for electrical coupling and electric coupling arrangement
#20Assembly comprising hybrid interconnecting means including intermediate interconnecting elements and sintered metal joints, and manufacturing process
#21Electronics package having a multi-thickness conductor layer and method of manufacturing thereof
#22IC package
#23Engineered polymer-based electronic materials
#24Vertical shielding and interconnect for SIP modules
#25Die stack assembly using an edge separation structure for connectivity through a die of the stack
#26Electronic device and method for producing an electronic device
#27Structures and methods for low temperature bonding using nanoparticles
#28Bonding structure and method for producing bonding structure
#29Sintering materials and attachment methods using same
#30POROUS METALLIC FILM AS DIE ATTACH AND INTERCONNECT
#31Sintered conductive matrix material on wire bond
#32Low pressure sintering powder
#33Method for manufacturing metal powder
#34Electronic component module and method for manufacturing electronic component module
#35Semiconductor device and method for manufacturing the semiconductor device
#36Electrode connection structure and electrode connection method
#37IC package
#38Through silicon vias and thermocompression bonding using inkjet-printed nanoparticles
#39Method of bonding with silver paste
#40Flip chip assembly and process with sintering material on metal bumps
#41Flip-chip hybridisation of two microelectronic components using a UV anneal
#42Electronic component-mounted structure, IC card and COF package
#43Sintered body made from silver fine particles
#44Semiconductor device and method for manufacturing same
#45Semiconductor device and method for manufacturing the semiconductor device
#46Porous Metallic Film as Die Attach and Interconnect
#47Method for building vertical pillar interconnect
#48Flip chip package for DRAM with two underfill materials
#49Conductive connecting member and manufacturing method of same
#50Electrically conductive paste, and electrically conducive connection member produced using the paste
#51Flip-chip QFN structure using etched lead frame
#52METAL NANOINK AND PROCESS FOR PRODUCING THE METAL NANOINK, AND DIE BONDING METHOD AND DIE BONDING APPARATUS USING THE METAL NANOINK
#53Flip chip assembly and process with sintering material on metal bumps
#54Method for manufacturing semiconductor device
#55Semiconductor package and method for manufacturing the same
#56Semiconductor apparatus and the method of manufacturing the same
#57ELECTRONIC DEVICE AND MANUFACTURING METHOD OF ELECTRONIC DEVICE
#58Method for low stress flip-chip assembly of fine-pitch semiconductor devices
#59Metal nanoink and process for producing the metal nanoink, and die bonding method and die bonding apparatus using the metal nanoink
#60Flip-bonded dual-substrate inductor, flip-bonded dual-substrate inductor, and integrated passive device including a flip-bonded dual-substrate inductor
#61STRUCTURE OF A PACKAGE FOR ELECTRONIC DEVICES AND METHOD FOR MANUFACTURING THE PACKAGE
#62METHODS AND STRUCTURES FOR A VERTICAL PILLAR INTERCONNECT
#63Semiconductor device including double-sided multi-electrode chip embedded in multilayer wiring substrate
#64Method of interconnecting electronic wafers
#65Electronic member, electronic part and manufacturing method therefor
#66Method for low stress flip-chip assembly of fine-pitch semiconductor devices
#67Bonding apparatus and bonding method
#68Bonding apparatus and bonding method
#69Method for manufacturing conductors and semiconductors
#70LOW STRESS, LOW-TEMPERATURE METAL-METAL COMPOSITE FLIP CHIP INTERCONNECT
#71Method of bonding
#72Semiconductor apparatus, manufacturing method of semiconductor apparatus, and joint material
#73Electronic element that includes multilayered bonding interface between first electrode having aluminum-containing surface and second electrode composed of metal nanoparticle sintered body
#74SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
#75Semiconductor device and manufacturing method thereof