211074 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector; Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester Combinations of two or more hardening methods provided for in at least two different groups from - , e.g. for hybrid thermoplastic-thermosetting adhesives
Adhesive for semiconductor, production method therefor, and semiconductor device and production method therefor
#2Hybrid bonding materials comprising ball grid arrays and metal inverse opal bonding layers, and power electronics assemblies incorporating the same
#3Method and system for producing component mounting board
#4Mounted structure and manufacturing method of mounted structure
#5Bonded structure using conductive adhesives, and a manufacturing method thereof