211079 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector; Bonding techniques; Direct bonding, i.e. joining surfaces by means of intermolecular attracting interactions at their interfaces, e.g. covalent bonds, van der Waals forces between electrically insulating surfaces, e.g. oxide or nitride layers
SELF-ALIGNMENT FOR BONDING OF SEMICONDUCTOR DEVICES
#2PHOTONIC PACKAGES WITH MODULES AND FORMATION METHOD THEREOF
#3PHOTONIC PACKAGES WITH MODULES AND FORMATION METHOD THEREOF
#4Method of manufacturing a semiconductor device
#5Electronic device bonding structure and fabrication method thereof
#6Modified direct bond interconnect for FPAs
#7Mixed hybrid bonding structures and methods of forming the same
#8Mixed hybrid bonding structures and methods of forming the same
#9Optical-electrical interposers
#10Method for fabricating substrate structure and substrate structure fabricated by using the method
#11Optoelectronic component and method for producing an optoelectronic component
#12Semiconductor device including built-in crack-arresting film structure
#13Method for fabricating substrate structure and substrate structure fabricated by using the method
#14Semiconductor device including built-in crack-arresting film structure
#15Integrated device comprising high density interconnects in inorganic layers and redistribution layers in organic layers
#16SEMICONDUCTOR APPARATUS AND METHOD FOR FABRICATING THE SAME