211087 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector with the bump connector not providing any mechanical bonding; Pressing the bump connector against the bonding areas by means of another connector by means of an encapsulation layer or foil
Package substrate, semiconductor package and method of manufacturing the same
#2Package structure and its fabrication method
#3Chip support substrate, chip support method, three-dimensional integrated circuit, assembly device, and fabrication method of three-dimensional integrated circuit
#4Semiconductor device with semiconductor chips mounted on mounting board via conductive anaotubes