211118 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected by forming build-up interconnects at chip-level, e.g. for high density interconnects [HDI]; Pre-treatment of the connector or the bonding area Cleaning, e.g. oxide removal step, desmearing
Method for producing a printed circuit board structure
#2Circuit board structure
#3Embedded semiconductor device package and method of manufacturing thereof
#4Embedded semiconductor device package and method of manufacturing thereof
#5Redistribution layer system in package
#6Method of manufacturing an electronic module
#7Direct write interconnections and method of manufacturing thereof