H01L2224/82009 - CPC Classification Index

ClassID:

211117 ⎘

H01L2224/82009 - CPC Classification

Classification description:

Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected by forming build-up interconnects at chip-level, e.g. for high density interconnects [HDI] Pre-treatment of the connector or the bonding area

Sub-classes:

H01L2224/8201 » Cleaning, e.g. oxide removal step, desmearing 7
H01L2224/8203 » Reshaping, e.g. forming vias 150
H01L2224/82048 » Thermal treatments, e.g. annealing, controlled pre-heating or pre-cooling 2
H01L2224/82051 » Forming additional members 17

Recent Application in this class:

20210391298

2021-12-16

Chip to chip interconnect in encapsulant of molded semiconductor package

20140183751

2014-07-03

Three-dimensional structure in which wiring is provided on its surface

20140182887

2014-07-03

Three-dimensional structure for wiring formation

20140097004

2014-04-10

Method of mounting semiconductor chips, semiconductor device obtained using the method, method of connecting semiconductor chips, three-dimensional structure in which wiring is provided on its surface, and method of producing the same

20140090876

2014-04-03

20120248607

2012-10-04

Semiconductor die having fine pitch electrical interconnects

20110281138

2011-11-17