H01L2224/8285 - CPC Classification Index

ClassID:

211196 ⎘

H01L2224/8285 - CPC Classification

Classification description:

Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected by forming build-up interconnects at chip-level, e.g. for high density interconnects [HDI]; Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester

Sub-classes:

H01L2224/82855 » Hardening the adhesive by curing, i.e. thermosetting 3
H01L2224/8288 » Hardening the adhesive by cooling, e.g. for thermoplastics or hot-melt adhesives 2
H01L2224/82885 » Combinations of two or more hardening methods provided for in at least two different groups from to , e.g. for hybrid thermoplastic-thermosetting adhesives 0

Recent Application in this class:

20220238481

2022-07-28

Chip assembling on adhesion layer or dielectric layer, extending beyond chip, on substrate

20200321309

2020-10-08

Chip assembling on adhesion layer or dielectric layer, extending beyond chip, on substrate

20190124757

2019-04-25

Bare die integration with printed components on flexible substrate without laser cut

20190058241

2019-02-21

Fan-out semiconductor package

20180358326

2018-12-13

Chip assembling on adhesion layer or dielectric layer, extending beyond chip, on substrate

20170294403

2017-10-12

Chip assembling on adhesion layer or dielectric layer, extending beyond chip, on substrate

20170171958

2017-06-15

Bare die integration with printed components on flexible substrate without laser cut

20140124962

2014-05-08

Integrated circuit package including wire bond and electrically conductive adhesive electrical connections