211206 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected by forming build-up interconnects at chip-level, e.g. for high density interconnects [HDI]; Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester Hardening the adhesive by cooling, e.g. for thermoplastics or hot-melt adhesives
Electronic device having an under-fill element, a mounting method of the same, and a method of manufacturing a display apparatus having the electronic device
#2Electronic device having an under-fill element, a mounting method of the same, and a method of manufacturing a display apparatus having the electronic device