211204 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected by forming build-up interconnects at chip-level, e.g. for high density interconnects [HDI]; Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester; Hardening the adhesive by curing, i.e. thermosetting Ultraviolet [UV] curing
IC CHIP MOUNTING DEVICE, AND IC CHIP MOUNTING METHOD
#2Integrated circuit package including wire bond and electrically conductive adhesive electrical connections
#3Method and apparatus for assembling electric components on a flexible substrate as well as assembly of an electric component with a flexible substrate
#4Method for manufacturing 3D circuits from bare die or packaged IC chips by microdispensed interconnections