H01L2224/8293 - CPC Classification Index

ClassID:

211217 ⎘

H01L2224/8293 - CPC Classification

Classification description:

Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected by forming build-up interconnects at chip-level, e.g. for high density interconnects [HDI]; Post-treatment of the connector or the bonding area Reshaping

Sub-classes:

H01L2224/82931 » by chemical means, e.g. etching, anodisation 10
H01L2224/82935 » by heating means 0
H01L2224/82947 » by mechanical means, e.g. severing, pressing, stamping 15

Recent Application in this class:

20220393086

2022-12-08

Display device and method for manufacturing same

20220384402

2022-12-01

PIXEL, DISPLAY DEVICE INCLUDING SAME, AND MANUFACTURING METHOD THEREFOR

20140291850

2014-10-02

Method for manufacturing electronic devices