H01L2224/82935 - CPC Classification

Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected by forming build-up interconnects at chip-level, e.g. for high density interconnects [HDI]; Post-treatment of the connector or the bonding area; Reshaping by heating means

• H01L2224/82939 » using a laser 1
• H01L2224/82945 » using a corona discharge, e.g. electronic flame off [EFO] 0