211227 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector involving a temporary auxiliary member not forming part of the bonding apparatus
Sub-classes:ENCAPSULATED PACKAGE INCLUDING DEVICE DIES CONNECTED VIA INTERCONNECT DIE
#2INTEGRATED CIRCUIT ASSEMBLIES HAVING LOW SURFACE ENERGY EPOXY BARRIERS AND METHOD FOR EPOXY RESIN CONTAINMENT ON A SUBSTRATE
#3SEMICONDUCTOR SUBSTRATE ASSEMBLY AND MANUFACTURING METHOD THEREFOR
#4ENCAPSULATED PACKAGE INCLUDING DEVICE DIES CONNECTED VIA INTERCONNECT DIE
#5DISCONTINUOUS PATTERNED BONDS FOR SEMICONDUCTOR DEVICES AND ASSOCIATED SYSTEMS AND METHODS
#6Encapsulated package including device dies connected via interconnect die
#7Pressure sintering device and method for manufacturing an electronic component
#8Discontinuous patterned bonds for semiconductor devices and associated systems and methods
#9Package containing device dies and interconnect die and redistribution lines
#10Manufacturing method of package structure
#11Interconnect chips
#12Methods of fabricating semiconductor packages including reinforcement top die
#13Discontinuous patterned bonds for semiconductor devices and associated systems and methods
#14Interconnect chips
#15Method for expanding spacings in light-emitting element array
#16Semiconductor device and manufacturing method of semiconductor device
#17Semiconductor device and manufacturing method therefor
#18Method for die and clip attachment
#19APPARATUS AND METHODS FOR MICRO-TRANSFER-PRINTING
#20Selective laser-assisted transfer of discrete components
#21Resin-encapsulated semiconductor device
#223D MICROMOLD AND PATTERN TRANSFER
#23APPARATUS AND METHODS FOR MICRO-TRANSFER-PRINTING
#24Method for arranging electronic switching elements, electronic switching arrangement and use of a carrier having a bonding layer
#25Apparatus and methods for micro-transfer-printing
#26Resin-encapsulatd semiconductor device and method of manufacturing the same
#27Discontinuous patterned bonds for semiconductor devices and associated systems and methods
#28Packaged semiconductor devices having ribbon wires
#29Apparatus and methods for micro-transfer-printing
#30Apparatus and methods for micro-transfer-printing
#31Apparatus and methods for micro-transfer-printing
#32Apparatus and methods for micro-transfer-printing
#33Discontinuous patterned bonds for semiconductor devices and associated systems and methods
#34Semiconductor device and manufacturing method for the same
#35Semiconductor device and manufacturing method thereof
#36Method for bonding substrates
#37Method for producing a semiconductor module by using an adhesion carrier
#38Integrated bondline spacers for wafer level packaged circuit devices
#39Discontinuous patterned bonds for semiconductor devices and associated systems and methods
#40Integrated bondline spacers for wafer level packaged circuit devices
#41Low void solder joint for multiple reflow applications
#42Method for manufacturing semiconductor device, and semiconductor device
#43Integrated bondline spacers for wafer level packaged circuit devices
#44Vacuum thermal bonding apparatus
#45METHOD AND SYSTEM FOR WAFER AND STRIP LEVEL BATCH DIE ATTACH ASSEMBLY
#46SYSTEM IN PACKAGE MODULE ASSEMBLY
#47Semiconductor light emitting element
#48PRESSURE-SENSITIVE ADHESIVE TAPE FOR RESIN ENCAPSULATION AND METHOD FOR PRODUCING RESIN ENCAPSULATION TYPE SEMICONDUCTOR DEVICE
#49Semiconductor device and method of manufacturing thereof
#50Semiconductor component and corresponding production method
#51Chip assembly with a coreless substrate employing a patterned adhesive layer
#52Lead frame semiconductor device
#53Method for producing chip stacks, and a carrier for carrying out the method
#54Component assembly using a temporary attach material
#55Discontinuous patterned bonds for semiconductor devices and associated systems and methods
#56Fabricating method of semiconductor package structure
#57Low void solder joint for multiple reflow applications
#58Stacked semiconductor device and manufacturing method thereof
#59Semiconductor device having agglomerate terminals
#60Routable array metal integrated circuit package fabricated using partial etching process
#61Method of fabricating a TSV for 3D packaging of semiconductor device
#62Integrated circuit packaging system with vertical interconnection and method of manufacture thereof
#63Semiconductor device comprising thin-film terminal with deformed portion
#64Chip assembly with a coreless substrate employing a patterned adhesive layer
#65Embedded ball grid array substrate and manufacturing method thereof
#66Electronic packaging apparatus and electronic packaging method
#67Method for producing a semiconductor element
#68Routable array metal integrated circuit package fabricated using partial etching process
#69METHOD OF PACKAGING LIGHT EMITTING DEVICE
#70Semiconductor package structure and fabricating method of semiconductor package structure
#71Occam process for components having variations in part dimensions
#72Semiconductor device and production method thereof
#73SEMICONDUCTOR PACKAGE PROCESS WITH IMPROVED DIE ATTACH METHOD FOR ULTRATHIN CHIPS
#74Thin package system with external terminals and method of manufacture thereof
#75Method of Magnetically Driven Simultaneous Assembly
#76Semiconductor device
#77Method for Producing Semiconductor Chips and Corresponding Semiconductor Chip
#78Light emitting element and fabricating method thereof
#79Routable array metal integrated circuit package
#80Very extremely thin semiconductor package
#81Method for producing a semiconductor component
#82Method of manufacturing semiconductor package with etch removal of carrier frame and base plating layer
#83Semiconductor device
#84Integrated circuit package system with rigid locking lead
#85Method for forming lead frame land grid array
#86Integrated circuit package system with lead locking structure
#87Semiconductor substrate and semiconductor device
#88Method of manufacturing a semiconductor component with a low cost leadframe using a non-metallic base structure
#89Non-leaded semiconductor package and a method to assemble the same
#90Semiconductor device
#91Semiconductor package and fabrication method thereof
#92Semiconductor device and manufacturing method thereof
#93Manufacturing method of electronic device
#94Wiring substrate, method of manufacturing wiring substrate, and electronic apparatus
#95Optoelectric composite substrate and electronic apparatus
#96Circuit device
#97OPTICAL SENSOR, INK CARTRIDGE, AND INKJET APPARATUS
#98Method and device for connecting chips
#99Method of manufacturing a semiconductor device
#100Semiconductor component with a thin semiconductor chip and a stiff wiring substrate, and methods for producing and further processing of thin semiconductor chips
#101Thin package system with external terminals
#102Die pad for semiconductor packages and methods of making and using same
#103Method of manufacturing wiring board
#104Light emitting diode device having advanced light extraction efficiency and preparation method thereof
#105Semiconductor device
#106Leadframeless package structure and method
#107Method for separating a semiconductor layer from a substrate by irradiating with laser pulses
#108Thin-film semiconductor component and production method for said component
#109Semiconductor device and manufacturing method thereof
#110Thin film circuit device, manufacturing method thereof, electro-optical apparatus, and electronic system
#111Taped lead frames and methods of making and using the same in semiconductor packaging
#112Method for producing a semiconductor element
#113Lead frame, method of manufacturing the same, semiconductor device using lead frame and method of manufacturing semiconductor device
#114Thin-film semiconductor device and method of manufacturing the same
#115Wafer level chip stack method
#116Method of manufacturing a semiconductor device
#117Adhesive film for manufacturing semiconductor device
#118Opto-electronic element with a metallized carrier
#119Method of forming wirings for tile-shaped elements, structures of wirings for tile-shaped elements, and electronic equipment
#120Semiconductor device
#121Semiconductor element, semiconductor device, method for manufacturing semiconductor element, method for manufacturing semiconductor device, and electronic apparatus
#122Surface-mounted light-emitting diode and method
#123Thin film circuit device, manufacturing method thereof, electro-optical apparatus, and electronic system
#124Optical module, method of manufacturing the same, optical communication device and electronic device using the same