Patents-Review.com
ClassID:

211240 ⎘

H01L2224/83024 - CPC Classification

Classification description:

Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector; Pre-treatment of the layer connector or the bonding area Applying flux to the bonding area

Recent Application in this class:
#1
20260005180
2026-01-01

LAND-SIDE DIE COOLING OF DOUBLE-SIDED PACKAGE SUBSTRATES

 #2
20250246444
2025-07-31

Chip Package System Having A Vapor Chamber With Solder Thermal Interface Material And Method Of Manufacturing Same

 #3
20230411335
2023-12-21

THERMOSETTING RESIN COMPOSITION, SEMICONDUCTOR DEVICE AND ELECTRICAL/ELECTRONIC COMPONENT

 #4
20210118843
2021-04-22

Soldering a conductor to an aluminum metallization

 #5
20200243480
2020-07-30

Soldering a conductor to an aluminum metallization

 #6
20200219848
2020-07-09

Chip assembly

 #7
20200219841
2020-07-09

Soldering a conductor to an aluminum metallization

 #8
20190035764
2019-01-31

Soldering a conductor to an aluminum metallization

 #9
20190035762
2019-01-31

Method of manufacturing semiconductor device

 #10
20180068982
2018-03-08

Chip assembly

 #11
20180001614
2018-01-04

APPARATUS AND METHODS FOR MICRO-TRANSFER-PRINTING

 #12
20170301645
2017-10-19

Method and apparatus for connecting packages onto printed circuit boards

 #13
20170207193
2017-07-20

APPARATUS AND METHODS FOR MICRO-TRANSFER-PRINTING

 #14
20170135227
2017-05-11

Engineered Residue Solder Paste Technology

 #15
20170103964
2017-04-13

Apparatus and methods for micro-transfer-printing

 #16
20170025374
2017-01-26

Thermosetting resin composition, semiconductor device, and electrical/electronic component

 #17
20160111395
2016-04-21

Method of forming a chip assembly with a die attach liquid

 #18
20160111392
2016-04-21

Method and apparatus for connecting packages onto printed circuit boards

 #19
20160020130
2016-01-21

Apparatus and methods for micro-transfer-printing

 #20
20160020127
2016-01-21

Apparatus and methods for micro-transfer-printing

 #21
20160020120
2016-01-21

Apparatus and methods for micro-transfer-printing

 #22
20160016399
2016-01-21

Apparatus and methods for micro-transfer-printing

 #23
20150060898
2015-03-05

METHOD FOR LOW TEMPERATURE BONDING OF ELECTRONIC COMPONENTS

 #24
20140252593
2014-09-11

Method and apparatus for connecting packages onto printed circuit boards

 #25
20140209284
2014-07-31

Manufacturing process and heat dissipating device for forming interface for electronic component

 #26
20140110848
2014-04-24

Strong, heat stable junction

 #27
20130334292
2013-12-19

Method for manufacturing printed circuit boards

 #28
20130043015
2013-02-21

Manufacturing process and heat dissipating device for forming interface for electronic component

 #29
20120187862
2012-07-26

Light emitting die (LED) packages and related methods

 #30
20120007117
2012-01-12

Submount for Electronic Die Attach with Controlled Voids and Methods of Attaching an Electronic Die to a Submount Including Engineered Voids

 #31
20110089462
2011-04-21

Method for low temperature bonding of electronic components

 #32
20100025091
2010-02-04

Printed circuit boards