H01L2224/83009 - CPC Classification Index

ClassID:

211231 ⎘

H01L2224/83009 - CPC Classification

Classification description:

Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector Pre-treatment of the layer connector or the bonding area

Sub-classes:

H01L2224/8301 » Cleaning the layer connector, e.g. oxide removal step, desmearing 29
H01L2224/8302 » Applying permanent coating to the layer connector in the bonding apparatus, e.g. in-situ coating 14
H01L2224/83022 » Cleaning the bonding area, e.g. oxide removal step, desmearing 28
H01L2224/83024 » Applying flux to the bonding area 30
H01L2224/83026 » Applying a precursor material to the bonding area 18
H01L2224/8303 » Reshaping the layer connector in the bonding apparatus, e.g. flattening the layer connector 25
H01L2224/83048 » Thermal treatments, e.g. annealing, controlled pre-heating or pre-cooling 85
H01L2224/83051 » Forming additional members, e.g. dam structures 290

Recent Application in this class:

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Method of Electronic Devices Packaging Underfill

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PACKAGE STRUCTURE AND PACKAGING METHOD

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WAFER BONDING METHOD AND SEMICONDUCTOR STRUCTURE MANUFACTURED USING THE SAME

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CONTROLLING ADHESIVE REFLOW FOR TRANSFER PRINTING

20250006687

HEAT DISSIPATION IN SEMICONDUCTOR DEVICES

20240282747

DBI to SI bonding for simplified handle wafer

20240186284

DBI TO SI BONDING FOR SIMPLIFIED HANDLE WAFER

20240071976

SEMICONDUCTOR DEVICE WITH A POLYMER LAYER

20230378124

MICROELECTRONIC ASSEMBLY WITH UNDERFILL FLOW CONTROL

20230191747

ADHESIVE BONDING COMPOSITION AND METHOD OF USE

20210233889

DBI to SI bonding for simplified handle wafer

20210013052

Method for producing an at least partly packaged semiconductor wafer

20200365552

Adhesive bonding composition and method of use

20200343216

Bonding apparatus, bonding system, bonding method and storage medium

20190385973

Bonding apparatus, bonding system, bonding method and storage medium

20190341364

Adhesive bonding composition and method of use

20190326252

DBI to Si bonding for simplified handle wafer

20190006313

METHOD FOR PERMANENT BONDING OF WAFERS

20180308831

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

20180248087

Method of manufacturing optical component

20180247914

Method of bonding semiconductor substrates

20180158796

Bonding apparatus, bonding system, bonding method and storage medium

20170263595

Method of manufacturing semiconductor device

20170221856

Method for bonding substrates together, and substrate bonding device

20170179114

Fabrication method of a stack of electronic devices

20170154866

Adhesive bonding composition and method of use

20160211195

Method of attaching an electronic part to a copper plate having a surface roughness

20160155721

Bonding method, storage medium, bonding apparatus and bonding system

20160111394

Method for permanent bonding of wafers

20150104902

Method for fastening chips with a contact element onto a substrate provided with a functional layer having openings for the chip contact elements

20140353362

Laser ablation process for manufacturing submounts for laser diode and laser diode units

20120107552

Chip Attachment Layer Having Traverse-Aligned Conductive Filler Particles

20100289138

SUBSTRATE STRUCTURE FOR FLIP-CHIP INTERCONNECT DEVICE

20100213622

Semiconductor device