H01L2224/83053 - CPC Classification Index

ClassID:

211252 ⎘

H01L2224/83053 - CPC Classification

Classification description:

Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector Bonding environment

Sub-classes:

H01L2224/83054 » Composition of the atmosphere 11
H01L2224/83085 » being a liquid, e.g. for fluidic self-assembly 9
H01L2224/8309 » Vacuum 70
H01L2224/83091 » Under pressure 37
H01L2224/83095 » Temperature settings 33

Recent Application in this class:

20250149510

HETEROGENEOUS ANNEALING METHOD AND DEVICE

20230207322

Heterogeneous annealing method and device

20200328193

Heterogeneous annealing method

20200294956

Arrangement and method for joining at least two joining partners

20170301656

Heterogeneous device

20160099233

Heterogeneous annealing method and device

20150044824

Method for manufacturing a fan-out WLP with package

20140061949

Heterogeneous annealing method and device

20120313253

Fan-out microelectronic unit WLP having interconnects comprising a matrix of a high melting point, a low melting point and a polymer material