211253 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector; Bonding environment Composition of the atmosphere
Sub-classes:SEMICONDUCTOR DEVICE MANUFACTURING METHOD
#2WAFER LAMINATING METHOD
#3Micro-selective sintering laser systems and methods thereof
#4System and Method for Immersion Bonding
#5Method for direct adhesion via low-roughness metal layers
#6Methods for preparing layered semiconductor structures
#7Process for connecting joining parts
#8Hermetically sealed wafer packages
#9Methods for producing a bond and a semiconductor module
#10Apparatus for heating a substrate during die bonding
#11Hermetically sealed wafer packages