H01L2224/83096 - CPC Classification Index

ClassID:

211263 ⎘

H01L2224/83096 - CPC Classification

Classification description:

Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector; Bonding environment; Temperature settings Transient conditions

Sub-classes:

H01L2224/83097 » Heating 67
H01L2224/83098 » Cooling 3

Recent Application in this class:

20200021269

2020-01-16

Electronic devices formed in a cavity between substrates

20180159503

2018-06-07

Electronic devices formed in a cavity between substrates and including a via

20180159493

2018-06-07

Methods of manufacturing electronic devices formed in a cavity

20180158801

2018-06-07

Methods of manufacturing electronic devices formed in a cavity and including a via

20080202678

2008-08-28

PRODUCTION METHOD OF ELECTRONIC APPARATUS, PRODUCTION METHOD OF ELECTRONIC EQUIPMENT IN WHICH ELECTRONIC APPARATUS IS PACKAGED, AND PRODUCTION METHOD OF ARTICLE IN WHICH ELECTRONIC APPARATUS IS MOUNTED

20080042300

2008-02-21

Circuit substrate and semiconductor device

20070207592

2007-09-06

Wafer bonding of damascene-patterned metal/adhesive redistribution layers