211269 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus using surface energy, e.g. capillary forces
Semiconductor device and manufacturing method of a semiconductor device
#302Flip chip mounting process and flip chip assembly
#303Semiconductor device
#304Semiconductor device and method for fabricating the same
#305Stacked semiconductor module
#306SEMICONDUCTOR DEVICE, AND MANUFACTURING METHOD THEREOF, AND DISPLAY DEVICE AND ITS MANUFACTURING METHOD
#307Method of thinning a block transferred to a substrate
#308Method for coating two elements hybridized by means of a soldering material
#309Solder joint flip chip interconnection having relief structure
#310Stacked semiconductor module
#311Solder joint flip chip interconnection
#312Integrated capacitors in package-level structures, processes of making same, and systems containing same
#313SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING SAME AND METHOD OF REPAIRING SAME
#314Bonded structure and bonding method
#315Solder Interconnect
#316Electronic device having a wiring substrate
#317Semiconductor device producing method
#318Semiconductor device and manufacturing method therefor
#319Electronic component mounting method
#320Printed circuit board and method thereof and a solder ball land and method thereof
#321Modified chip attach process
#322Semiconductor device and manufacturing method of semiconductor device
#323Semiconductor device
#324Interconnecting a chip and a substrate by bonding pure metal bumps and pure metal spots
#325Flip chip semiconductor assembly with variable volume solder bumps
#326BOARD AND MANUFACTURING METHOD FOR THE SAME
#327Flip chip mounting method, flip chip mounting apparatus and flip chip mounting body
#328Wafer Level Chip Scale Packages Including Redistribution Substrates and Methods of Fabricating the Same
#329Semiconductor device and method of manufacturing the same
#330Electronic apparatus manufacturing method
#331PACKAGED INTEGRATED CIRCUITS HAVING SURFACE MOUNT DEVICES AND METHODS TO FORM PACKAGED INTEGRATED CIRCUITS
#332Multi-die wafer level packaging
#333Thermal mechanical flip chip die bonding
#334Integrated circuit packaging system with interposer
#335Methods for manufacturing semiconductor devices
#336Manufacturing method for electronic devices
#337Flat Display Device
#338Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument
#339WAFER-LEVEL UNDERFILL PROCESS USING OVER-BUMP-APPLIED RESIN
#340FLIP-CHIP MOUNTING APPARATUS
#341Method and structure for dispensing chip underfill through an opening in the chip
#342Method of producing electronic apparatus
#343MANUFACTURING APPARATUS AND METHOD FOR AN ELECTRONIC APPARATUS
#344Flip-chip type semiconductor device
#345Method And Device For Enhancing Solderability
#346Semiconductor device having external connection terminals and method of manufacturing the same
#347Semiconductor device and manufacturing method of the same
#348METHOD OF MANUFACTURING INTERCONNECT SUBSTRATE AND SEMICONDUCTOR DEVICE
#349Solder cap application process on copper bump using solder powder film
#350Method for manufacturing a circuit board structure, and a circuit board structure
#351Chip embedded substrate and method of producing the same
#352Semiconductor device and method for manufacturing thereof
#353Semiconductor device and manufacturing method therefor
#354Semiconductor package and method for manufacturing the same
#355Stack circuit member and method
#356Multi-die wafer level packaging
#357Semiconductor device and manufacturing method of the same
#358Semiconductor device and fabrication method thereof
#359Mold design and semiconductor package
#360Flip-chip semiconductor package and package substrate applicable thereto
#361Chip-stacked package structure
#362Wiring board and semiconductor package using the same
#363SEMICONDUCTOR DEVICE INCLUDING WIRING SUBSTRATE HAVING ELEMENT MOUNTING SURFACE COATED BY RESIN LAYER
#364Semiconductor device with a semiconductor chip connected in a flip chip manner
#365Semiconductor device
#366Semiconductor device and manufacturing method thereof
#367Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices
#368Semiconductor device and manufacturing method of the semiconductor device
#369Method of mounting an electronic component and mounting apparatus
#370LSI package provided with interface module, and transmission line header employed in the package
#371Integrated circuit packaging system with interposer
#372SEMICONDUCTOR PACKAGE HAVING EVAPORATED SYMBOLIZATION
#373Modular board device, high frequency module, and method of manufacturing the same
#374Conductive systems and devices including wires coupled to anisotropic conductive film, and methods of forming the same
#375Reducing underfill keep out zone on substrate used in electronic device processing
#376Capillary-flow underfill compositions, packages containing same, and systems containing same
#377Semiconductor integrated circuit package having electrically disconnected solder balls for mounting
#378Stacked package and method for manufacturing the package
#379Assembly and Method of Placing the Assembly on an External Board
#380UNDERFILL DISPENSE AT SUBSTRATE APERTURE
#381CHIP LOCATION IDENTIFICATION
#382Modified chip attach process
#383Methods for attaching microfeature dies to external devices
#384FLIP CHIP SEMICONDUCTOR ASSEMBLY WITH VARIABLE VOLUME SOLDER BUMPS
#385MOUNTING STRUCTURE OF SEMICONDUCTOR DEVICE HAVING FLUX AND UNDER FILL RESIN LAYER AND METHOD OF MOUNTING SEMICONDUCTOR DEVICE
#386Thermal method to control underfill flow in semiconductor devices
#387Method of manufacturing a semiconductor device
#388Flip chip mounting process and flip chip assembly
#389Device With Mounted Electronic Parts, Method Of Producing The Same, Protection Circuit Module Of Secondary Battery, And Battery Package
#390Vibration-Assisted Method for Underfilling Flip-Chip Electronic Devices
#391Semiconductor Device and Manufacturing Method Thereof, Semiconductor Package, and Electronic Apparatus
#392INTEGRATED CIRCUIT CHIP FORMED ON SUBSTRATE
#393Stacked package electronic device
#394Electronic Component Mounting Structure
#395Methodology to control underfill fillet size, flow-out and bleed in flip chips (FC), chip scale packages (CSP) and ball grid arrays (BGA)
#396Ultrasound Transducer and Method for Implementing High Aspect Ration Bumps for Flip-Chip Two Dimensional Arrays
#397Process for forming bumps and solder bump
#398Solder joint flip chip interconnection having relief structure
#399Electronic device substrate and its fabrication method, and electronic device and its fabrication method
#400Devices with microjetted polymer standoffs
#401Flip chip bonding structure
#402Semiconductor device and manufacturing method of a semiconductor device
#403Semiconductor wafer coat layers and methods therefor
#404Flip-chip type semiconductor device
#405Semiconductor package with heat spreader
#406Method, system, and apparatus for gravity assisted chip attachment
#407Method for manufacturing semiconductor device
#408PACKAGE WARPAGE CONTROL
#409Wiring board with connection electrode formed in opening and semiconductor device using the same
#410Chip package
#411Flip-Chip Device Having Underfill in Controlled Gap
#412Method for manufacturing semiconductor package capable of potting thermosetting resin while being heated
#413SEMICONDUCTOR COMPONENT AND METHOD FOR PRODUCING SEMICONDUCTOR COMPONENTS
#414CHIP CONNECTOR
#415Use of a hotmelt adhesive, pasty fixation compound for micro devices and detector for detecting ionizing radiation
#416Interconnect substrate, semiconductor device, and method of manufacturing the same
#417Flip-chip semiconductor device and method for fabricating the same
#418Tooling for coupling multiple electronic chips
#419Method of forming a microelectronic package and microelectronic package formed according to the method
#420Method and device for contacting semiconductor chips
#421Integrated capacitors in package-level structures, processes of making same, and systems containing same
#422PACKAGE WARPAGE CONTROL
#423Face down type semiconductor device and manufacturing process of face down type semiconductor device
#424Semiconductor package structure with constraint stiffener for cleaning and underfilling efficiency
#425Peel strength simulating apparatus, peel strength simulating program storage medium, and peel strength simulating method
#426Semiconductor device and manufacturing method of the same
#427Heat spreader and package structure utilizing the same
#428Semiconductor device, and inspection method thereof
#429Coaxial through chip connection
#430Negative thermal expansion material filler for low CTE composites
#431Inhibiting underfill flow using nanoparticles
#432Microelectronic 3-D package defining thermal through vias and method of making same
#433CIRCUIT SUBSTRATES, SEMICONDUCTOR DEVICES, SEMICONDUCTOR MANUFACTURING APPARATUSES, METHODS FOR MANUFACTURING CIRCUIT SUBSTRATES, AND METHODS FOR MANUFACTURING SEMICONDUCTOR DEVICES
#434Pin-type chip tooling
#435Semiconductor devices including voltage switchable materials for over-voltage protection
#436Dispensing device and mounting system
#437Solder joint flip chip interconnection
#438Void-free circuit board and semiconductor package having the same
#439Semiconductor package and substrate structure thereof
#440Stacked semiconductor module
#441Underfill aiding process for a tape
#442FLIP CHIP PACKAGE
#443Thermal expansion compensation graded IC package
#444Electronic device and manufacturing method of the same
#445Semiconductor device and semiconductor device production method
#446Grooved substrates for uniform underfilling solder ball assembled electronic devices
#447METHOD FOR FABRICATING SEMICONDUCTOR PACKAGES
#448Microfeature assemblies including interconnect structures and methods for forming such interconnect structures
#449Printed circuit board and method thereof and a solder ball land and method thereof
#450Underfilled semiconductor die assemblies and methods of forming the same
#451Method And Device For Enhancing Solderability
#452Bonded structure and bonding method
#453Integrated circuit with low-stress under-bump metallurgy
#454Semiconductor device-composing substrate and semiconductor device
#455Method of making an electronic assembly
#456Self alignment features for an electronic assembly
#457Process for exposing solder bumps on an underfill coated semiconductor
#458Method of manufacturing electronic circuit device
#459Electronic component and electronic configuration
#460Substrate applicable to both wire bonding and flip chip bonding, smart card modules having the substrate and methods for fabricating the same
#461Bumped die and wire bonded board-on-chip package
#462Self alignment features for an electronic assembly
#463Substrate for manufacturing semiconductor device, semiconductor device manufacturing method
#464Semiconductor package having dual interconnection form and manufacturing method thereof
#465Semiconductor assemblies including redistribution layers and packages and assemblies formed therefrom
#466Low stress chip attachment with shape memory materials
#467Flip chip packaging using recessed interposer terminals
#468Coaxial through chip connection
#469Post-attachment chip-to-chip connection
#470Rigid-backed, membrane-based chip tooling
#471Through chip connection
#472Semiconductor device packaging substrate and semiconductor device packaging structure
#473Substrate for pre-soldering material and fabrication method thereof
#474Inverse chip connector
#475Chip connector
#476Stack circuit member and method
#477Profiled contact
#478Patterned contact
#479Contact-based encapsulation
#480Membrane-based chip tooling
#481Semiconductor device modules, semiconductor devices, and microelectronic devices
#482Semiconductor device
#483Sealing membrane for thermal interface material
#484Chip package having chip extension and method
#485Packaging structure and method
#486Apparatus and methods for constructing balanced chip packages to reduce thermally induced mechanical strain
#487Flip-chip semiconductor device
#488Semiconductor device with substrate having penetrating hole having a protrusion
#489Electronic component and electronic configuration
#490Semiconductor device and method of manufacturing the same
#491Semiconductor device assemblies with compliant spring contact structures
#492Fabrication of compliant spring contact structures and use thereof
#493Semiconductor integrated circuit package having electrically disconnected solder balls for mounting
#494Semiconductor integrated circuit package having electrically disconnected solder balls for mounting
#495Underfill dispense at substrate aperture
#496Structure for mounting semiconductor part in which bump and land portion are hardly detached from each other and method of manufacturing mounting substrate used therein
#497Method of fabricating a substrate with a concave surface
#498Semiconductor wafer coat layers and methods therefor
#499Method for manufacturing semiconductor apparatus, and semiconductor apparatus and electric appliance
#500Semiconductor integrated circuit (IC) packaging with carbon nanotubes (CNT) to reduce IC/package stress
#501Flip chip interconnection having narrow interconnection sites on the substrate
#502Wiring board, electronic circuit board, electronic apparatus and manufacturing method of electronic circuit board
#503Semiconductor device
#504Wiring board and method of manufacturing the same
#505Strain silicon wafer with a crystal orientation (100) in flip chip BGA package
#506Method to accommodate increase in volume expansion during solder reflow
#507Heat spreader and package structure utilizing the same
#508Composition of aromatic or cycloaliphatic amine-derived polyepoxide and polyamine
#509Semiconductor device
#510Interconnecting substrate and semiconductor device
#511Semiconductor package, ID generating system thereof, ID recognizing system thereof, ID recognition method thereof, semiconductor integrated circuit chip, ID generating system thereof, ID recognizing system thereof, and ID recognition method thereof
#512Consolidated flip chip BGA assembly process and apparatus
#513IC chip package structure and underfill process
#514Semiconductor device and manufacturing method therefor
#515Module substrate and disk apparatus
#516Flip chip system with organic/inorganic hybrid underfill composition
#517Method for flip-chip mounting utilizing a delay curing-type adhesive with two-part hardening resin
#518Flexible wiring substrate, semiconductor device and electronic device using flexible wiring substrate, and fabricating method of flexible wiring substrate
#519Neo-wafer device comprised of multiple singulated integrated circuit die
#520Semiconductor device and method for fabricating the same
#521Method for manufacturing a semiconductor device
#522Rfid tag
#523Methods of making microelectronic packages with conductive elastomeric posts
#524Packaging method for an electronic element
#525Method of manufacturing electric device
#526Semiconductor device and electronic apparatus
#527Wafer scale integration packaging and method of making and using the same
#528Packaging method, packaging structure and package substrate for electronic parts
#529High performance amine based no-flow underfill materials for flip chip applications
#530Microelectronic device packages and methods for controlling the disposition of non-conductive materials in such packages
#531Method for manufacturing electronic component-mounted board
#532Grooved substrates for uniform underfilling solder ball assembled electronic devices
#533Wiring substrate and semiconductor device using the same
#534Substrate grooves to reduce underfill fillet bridging
#535Methods for fabrication of thin semiconductor assemblies including redistribution layers and packages and assemblies formed thereby
#536Interposers for chip-scale packages and intermediates thereof
#537Apparatus and methods for wafer-level testing of the chip-scale semiconductor device packages
#538Method to fill the gap between coupled wafers
#539Semiconductor device, semiconductor device module and method of manufacturing the semiconductor device
#540Modified chip attach process and apparatus
#541Stacked package electronic device
#542Modular board device, high frequency module, and method of manufacturing same
#543Method for fabricating semiconductor packages
#544Compliant spring contact structures
#545Plasma processing method and method for fabricating electronic component module using the same
#546Package warpage control
#547Semiconductor device and manufacturing process therefor
#548Method for assembling semiconductor die packages with standard ball grid array footprint
#549Vibration-assisted method for underfilling flip-chip electronic devices
#550Flip chip package and process of forming the same
#551Wiring board and semiconductor package using the same
#552Method for bonding IC chips to substrates incorporating dummy bumps and non-conductive adhesive
#553Method and apparatus for shielding integrated circuits
#554LSI package provided with interface module, and transmission line header employed in the package
#555Thermally conductive compositions and methods of making thereof
#556Semiconductor device and method for manufacturing same
#557Capillary underfill channel
#558Semiconductor substrates including I/O redistribution using wire bonds and anisotropically conductive film, methods of fabrication and assemblies including same
#559Method and apparatus for underfilling semiconductor devices
#560Image sensor and manufacturing method thereof
#561Electronic package structure and the packaging process thereof
#562Semiconductor device with intermediate connector
#563Microconverter and laminated magnetic-core inductor
#564Semiconductor device and method for fabricating the same
#565Methods of reducing bleed-out of underfill and adhesive materials
#566Semiconductor device and method of making the same
#567Method of fabricating semiconductor device having a chip, reinforcing plate, and sealing material sharing a common rear surface
#568Semiconductor device
#569Wireless communication medium and method of manufacturing the same
#570Substrate for pre-soldering material and fabrication method thereof
#571Modified chip attach process and apparatus
#572Semiconductor package
#573Process of manufacturing a solder-fill for applying to semiconductor package
#574Solder-fill application for mounting semiconductor chip on PCB
#575Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument
#576Flip-chip type semiconductor device, production process for manufacturing such flip-chip type semiconductor device, and production process for manufacturing electronic product using such flip-chip type semiconductor device
#577Semiconductor device
#578Tin/indium lead-free solders for low stress chip attachment
#579Semiconductor integrated circuit package having electrically disconnected solder balls for mounting
#580Semiconductor substrates including I/O redistribution using wire bonds and anisotropically conductive film, methods of fabrication and assemblies including same
#581Method of surface-mounting semiconductor chip on PCB
#582Underfill and encapsulation of carrier substrate-mounted flip-chip components
#583Manufacturing method of semiconductor device, including differently spaced bump electrode arrays
#584Imaging system
#585Method for binding micro device to substrate