H01L2224/83148 - CPC Classification

Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector; Aligning involving movement of a part of the bonding apparatus

• H01L2224/83149 » being the lower part of the bonding apparatus, i.e. holding means for the bodies to be connected, e.g. XY table 1
• H01L2224/83169 » being the upper part of the bonding apparatus, i.e. bonding head 1