ClassID:

211291

H01L2224/83169 - CPC Classification

Classification description:

Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector; Aligning involving movement of a part of the bonding apparatus being the upper part of the bonding apparatus, i.e. bonding head

Sub-classes:
Recent Application in this class: