211290 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector; Aligning involving movement of a part of the bonding apparatus being the lower part of the bonding apparatus, i.e. holding means for the bodies to be connected, e.g. XY table Translational movements
SELECTIVE TRANSFER OF MICRO DEVICES
#2SELECTIVE MICRO DEVICE TRANSFER TO RECEIVER SUBSTRATE
#3SELECTIVE TRANSFER OF MICRO DEVICES
#4BONDING APPARATUS AND BONDING METHOD
#5Selective micro device transfer to receiver substrate
#6Selective micro device transfer to receiver substrate
#7Selective micro device transfer to receiver substrate
#8Selective micro device transfer to receiver substrate
#9Micro device arrangement in donor substrate
#10Selective micro device transfer to receiver substrate
#11Selective micro device transfer to receiver substrate
#12Selective transfer of micro devices
#13Substrate bonding apparatus, manufacturing system, and semiconductor device manufacturing method
#14Selective micro device transfer to receiver substrate
#15Micro device arrangement in donor substrate
#16Laminating structure of electronic device using transferring element, transferring apparatus for fabricating the electronic device and method for fabricating the electronic device
#17Micro device arrangement in donor substrate