211308 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector; Applying energy for connecting using a reflow oven
Sub-classes:SEMICONDUCTOR PACKAGE
#2IN-CAVITY EPOXY PLACEMENT FOR PACKAGE RELIABILITY
#3SEMICONDUCTOR DEVICE WITH A SEMICONDUCTOR DIE EMBEDDED BETWEEN AN EXTENDED SUBSTRATE AND A BOTTOM SUBSTRATE
#4LOW PRESSURE SINTERING POWDER
#5SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREFOR
#6POWER MODULE
#7SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREFOR
#8THERMOSETTING RESIN COMPOSITION, SEMICONDUCTOR DEVICE AND ELECTRICAL/ELECTRONIC COMPONENT
#9Diffusion soldering with contaminant protection
#10Semiconductor device with a semiconductor die embedded between an extended substrate and a bottom substrate
#11HEAT EXCHANGE METHOD USING FLUORINATED COMPOUNDS HAVING A LOW GWP
#12Semiconductor device resistant to thermal cracking and manufacturing method thereof
#13Diffusion soldering with contaminant protection
#14Low pressure sintering powder
#15DIE BONDING APPARATUS AND DIE BONDING METHOD
#16Adhesive for semiconductor device, and high productivity method for manufacturing said device
#17Method of Manufacturing a Multi-Chip Semiconductor Power Device
#18Acrylic composition for encapsulation, sheet material, laminated sheet, cured object, semiconductor device, and process for producing semiconductor device
#19LED backplane having planar bonding surfaces and method of making thereof
#20Wafer level flat no-lead semiconductor packages and methods of manufacture
#21Wafer level flat no-lead semiconductor packages and methods of manufacture
#22Wafer level flat no-lead semiconductor packages and methods of manufacture
#23Conductive paste and die bonding method
#24Semiconductor packaging structure and process
#25Semiconductor device with a semiconductor die embedded between an extended substrate and a bottom substrate
#26Sintering pastes with high metal loading for semiconductor die attach applications
#27Method for manufacturing semiconductor device including heating and pressuring a laminate having an adhesive layer
#28Electronic assembly with enhanced thermal dissipation
#29Bonded structure and method of manufacturing the same
#30Wafer level flat no-lead semiconductor packages and methods of manufacture
#31Display device including support films
#32Micro-transfer printing with volatile adhesive layer
#33Engineered polymer-based electronic materials
#34DIE BONDING APPARATUS AND DIE BONDING METHOD
#35Semiconductor packaging structure and process
#36Sinterable bonding material and semiconductor device using the same
#37Low pressure sintering powder
#38Method for manufacturing metal powder
#39Thermosetting resin composition, semiconductor device, and electrical/electronic component
#40Alternative compositions for high temperature soldering applications
#41Semiconductor device and manufacturing method of semiconductor device
#42Au-based solder die attachment semiconductor device and method for manufacturing the same
#43Electronic component and method for manufacturing electronic component
#44Semiconductor module
#45SEMICONDUCTOR DEVICE HAVING A STRESS-COMPENSATED CHIP ELECTRODE
#46Wafer level flat no-lead semiconductor packages and methods of manufacture
#47Placement method for circuit carrier and circuit carrier
#48Semiconductor module
#49Semiconductor module
#50Semiconductor module
#51Integrated circuit package
#52Dual solder layer for fluidic self assembly and electrical component substrate and method employing same
#53Semiconductor packaging structure and process
#54Electric component mounting method
#55Conductive paste and die bonding method
#56Electronic component and method for manufacturing electronic component
#57Semiconductor device with a semiconductor die embedded between an extended substrate and a bottom substrate
#58Semiconductor module and method for manufacturing the same
#59Solder joint structure, power module, power module substrate with heat sink and method of manufacturing the same, and paste for forming solder base layer
#60METHOD FOR CARRYING OUT SOLDER CONNECTIONS IN A TECHNOLOGICALLY OPTIMIZED MANNER
#61Anisotropic conductive adhesive with reduced migration
#62Multi-chip semiconductor power device
#63Joining method and semiconductor device manufacturing method
#64Manufacturing process and heat dissipating device for forming interface for electronic component
#65Low void solder joint for multiple reflow applications
#66Integrated circuit package
#67Discrete device mounted on substrate
#68Semiconductor device using diffusion soldering
#69Joining method and semiconductor device manufacturing method
#70Manufacturing process and heat dissipating device for forming interface for electronic component
#71Method for manufacturing wafer-bonded semiconductor device
#72SOLDER DEPOSITION SYSTEM AND METHOD FOR METAL BUMPS
#73Package structure, method for manufacturing same, and method for repairing package structure
#74SEMICONDUCTOR SENSOR DEVICE AND METHOD OF PACKAGING SAME
#75Low void solder joint for multiple reflow applications
#76Wafer level package with thermal pad for higher power dissipation
#77ELECTRONIC DEVICE, ELECTRONIC COMPONENT, AND METHOD OF MANUFACTURING CIRCUIT BOARD ASSEMBLY
#78Electronic element unit and reinforcing adhesive agent
#79EPOXY RESIN COMPOSITION FOR SEALING PACKING OF SEMICONDUCTOR, SEMICONDUCTOR DEVICE, AND MANUFACTURING METHOD THEREOF
#80Flux-free chip to wafer joint serial thermal processor arrangement
#81Flip-chip mounting method and bump formation method
#82Semiconductor device and method for fabricating the same
#83Adhesive tape, connected structure and semiconductor package
#84Method for stacking devices
#85I/O pad structures for integrated circuit devices
#86Methods of attaching a die to a substrate
#87Flip-chip mounting method and bump formation method
#88Flip-chip light emitting diode device without sub-mount
#89Flip-chip light emitting diode device without sub-mount