211341 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector; Bonding interfaces outside the semiconductor or solid-state body; Material with a principal constituent of the material being a solid not provided for in groups - , e.g. allotropes of carbon, fullerene, graphite, carbon-nanotubes, diamond
SEMICONDUCTOR PACKAGE WITH HEAT SPREADING LID
#2HEIGHT ADAPTABLE MULTILAYER SPACER
#3Graphene-coated heat spreader for integrated circuit device assemblies
#4Soldering a conductor to an aluminum layer
#5Illumination device
#6Illumination device
#7Bonding method of fixing an object to a rough surface
#8Jointing material, fabrication method for semiconductor device using the jointing material, and semiconductor device
#9Semiconductor packaging structure and process
#10Semiconductor device package having an underfill barrier
#11Semiconductor package
#12Semiconductor packaging structure and process
#13Composite substrate with alternating pattern of diamond and metal or metal alloy
#14Semiconductor packaging structure and process
#15Illumination device capable of decreasing shadow of lighting effect
#16Systems and methods for additive connections in integrated circuits